• Implementation guide

• Annual Event presentations

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Download the presentations of the October 21, 2009 conference.

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The SOI Design Experience

• Special supplement: SOI Industry Consortium

• ARM11, Cadence, Freescale, Voldman/ESD and more

• Toshiba's Cell Regza TV

» read the full edition

Kanazawa Institute of technology Freescale Semiconductor ARM IBM Berkeley, University of California Tyndall National Institute Applied Materials Mentor Graphics Magma Design Automation Infotech

Shin-Etsu Handotai Universitι Catholique de Louvain Samsung AMD STMicroelectronics Ritsumeikan University Cadence Design Systems Semico UMC Innovative Silicon

IMEC Soitec Synopsys NVIDIA Stanford University GLOBALFOUNDRIES Lam Research Varian KLA-Tencor Corporation CEA-Leti

Chartered Semiconductor Manufacturing Soitec Samsung CEA-Leti ARM Freescale Semiconductor Mentor Graphics KLA-Tencor Corporation Synopsys Applied Materials

Applications

(Courtesy of ARM, IBM, and Soitec, August 2007)

It's ideal for a broad set of applictions

Mobile devices, where:
• lower dynamic power reduces the overall operating power for graphic-intensive mobile applications;
• RF design can strongly benefit from SOI substrate isolation and passive component enhancement;
• application processors target higher performance in tighter power envelopes for the next digital mobile experience.

Consumer electronics and gaming, where:
• smaller form factors are key;
• better thermal management is required;
• performance gains can simplify system designs.

Embedded markets, where:
• the emphasis is on performance, size, power and reliability especially under challenging conditions as found in automotive, industrial, and medical markets.

Dataprocessing including graphics and storage, where:
• SOI is intended to enable higher system performance, more cache memory, and better power envelope management, leading to cheaper packaging solutions.