Author Archive Gianni PRATA

In addition to announcements of extensions of its existing platforms, AMD issued its SOI roadmap news (by codename)

In addition to announcements of extensions of its existing platforms, AMD issued its SOI roadmap news (by codename).

Plans for 2010 include:
• “Danube” – mainstream notebook platform featuring the first AMD mobile quad-core processors;
• “Nile” –  ultrathin notebook platform.
• “San Marino” and “Maranello” – 8- and 12-core processors for the volume server market with unprecedented performance-per-watt.
• “Leo” –  next-generation enthusiast-class desktop PC platform with the industry’s first six-core desktop CPU.

Plans for 2011 include:
• “Bulldozer” – a new x86 CPU core for linking with GPUs in single-chip Accelerated Processing Unit (APU) configurations.
• “Llano” – for mainstream notebooks and desktops, this APU will be the first in a family of next-generation designs that combine the power of the CPU and GPU onto a single piece of silicon.
• “Zambezi” – an enthusiast desktop processor with up to eight cores, featuring the first “Bulldozer” core.

NXP has launched the UBA2024 and UBA2024A integrated half-bridge power ICs

NXP has launched the UBA2024 and UBA2024A integrated half-bridge power ICs, based on the company’s EZ-HV SOI technology. They enable the easy design of low-cost, very compact, high-reliability, long-life florescent lamp (CFL) applications.

The MOSIS Service

The MOSIS Service, a leading provider of semiconductor fabrication solutions, has expanded its relationship with IBM to 45nm SOI for System-on-Chips (SOCs) and 180nm 7RF SOI for RF switches. This provides a low-cost route to prototyping and low-volume production.

Under a 5-year agreement, CEA-Leti and IBM will collaborate on semiconductor

Under a 5-year agreement, CEA-Leti and IBM will collaborate on semiconductor and nanoelectronics technology research for 22nm and beyond. CEA/Leti, which becomes a research associate of IBM and IBM’s semiconductor Joint Development Alliance ecosystem centered in Albany, N.Y., will reinforce this ecosystem through its specific expertise in low-power, SOI-based CMOS.

GlobalFoundries

GlobalFoundries
Open for Business

GlobalFoundries, a joint venture between AMD and the Advanced Technology Investment Company (ATIC) has been officially launched. In addition to manufacturing chips for AMD, the new foundry opens the door for a wide range of chip companies to gain early access to volume chip production using leading-edge technologies.

The Dresden cluster, the company’s current primary manufacturing facility, will be re-named Fab 1, with Module 1 initially focused on production of high-performance 45nm SOI technology. Jim Doran has been named senior vice president and general manager of Fab 1.

The company indicates it will continue its longstanding research and development collaboration with IBM, including membership in the IBM joint development alliance for SOI.

The Intel research results published in Nature Photonics regarding world-record performance

  • The Intel research results published in Nature Photonics regarding world-record performance using a silicon-based Avalanche Photodetector (APD) describes continued work on SOI (as detailed in ASN#8). Intel says this opens the door to lowering the cost of optical links running at data rates of 40Gbps or higher and proves, for the first time, that a silicon photonics device can exceed the performance of a device made with traditional, more expensive optical materials such as indium phosphide.

New from AMD

  • New from AMD (which builds all its 64-bit microprocessors on SOI):

    • the four-core Phenom™ II X4 (up to 3GHz) and Black Edition (3.2GHz) and the triple-core Phenom™ II X3 (up to 2.8GHz) on 45nm SOI, which are at the heart of the “Dragon” platform (with headroom for overclocking), targeting demanding gaming and consumer applications;

    • the Athlon™ Neo processor for ultra-thin notebook designs;

    • the Athlon™ X2 7850 Black Edition processor for PC users seeking a full-featured product with best-in-class price-performance;

    • the 40W ACP AMD Opteron™ EE processor, full-featured energy miser offering 13% power savings, and targeting very dense data center environments;

    • the six-core AMD Opteron processor code-named “Istanbul” is slated for delivery in June of this year, months ahead of schedule.

Qcept Technologies’ ChemetriQ® 3000

Qcept Technologies’ ChemetriQ® 3000, a new breed of non-visual defect (NVD) inspection systems, has been adopted by Soitec, the leading SOI wafer supplier. The ChemetriQ system is being used for incoming quality control of bare silicon wafers and process monitoring of SOI wafers. The two companies have agreed to collaborate on ongoing application development.

Inventor of Smart Cut™ Technology Honored

The IEEE has conferred the Cledo Brunetti Award on Dr. Michel Bruel.

At a ceremony at the IEDM in San Francisco, the IEEE Board of Directors gave the 2008 Cledo Brunetti Award to Dr. Michel Bruel for his invention of the Smart Cut™ layer transfer technology that enabled widespread adoption of SOI for CMOS circuits. One of the industry’s greatest honors, the award recognizes outstanding contributions to miniaturization in the electronics arts. Read More

Soitec Makes Key Appointments

Announcements in worldwide and Asia sales; China distribution.

Thomas Piliszczuk

Soitec, the world’s leading supplier of engineered substrates, has announced key appointments to its sales team and finance department, and a new distribution partnership for markets in China. Read More