Feb. 16, 2010 Skyworks Introduces Family of GaAs and SOI Antenna Switch Modules for 2/3/4G Wireless Broadband and Mobile Handset Applications
[Skyworks]

Feb. 16, 2010 RF Micro Devices(R) Introduces First Silicon Switches for 3G Smartphones and Other High Performance Applications
[RF Micro Devices]

Jan. 28, 2010 Remaking the design landscape
[System-Level Design]

Jan. 12, 2010 EUROSOI 2010 conference announces keynote presenters and technical program
[EUROSOI]

Jan. 1, 2010 CMOS Transitions to 22 and 15 nm
Scaling beyond the 22 nm node is likely to require fully depleted CMOS, either on SOI or bulk wafers [Semiconductor International]

Dec. 15, 2009 IBM Gains Confidence in 22 nm ETSOI
[Semiconductor International]

Nov. 27, 2009 Soitec CEO sees positive momentum in SOI markets
[EE Times]

Oct. 19, 2009 Leti's planar SOI technology suits low power 22nm node
[EE Times]

Oct. 16, 2009 Leti’s Planar-SOI Technology Meets Low-Power, 22nm Node Requirements, Supports Development of “Green” Products
[NanoTechWire.com]

Oct. 10, 2009 Designing for SoI with a standard flow, continued
[EDN]

Oct. 9, 2009 ARM 1176 in IBM SoI process demonstrates a cell-based flow
[EDN]

Sep. 16, 2009 Building an SOI IP/EDA Infrastructure
[Cadence]

Sep. 15, 2009 IBM Announces Highest Performance Embedded Processor for System-on-Chip Designs
[IBM]

Aug. 31, 2009 Chartered to start 32nm pilot runs in 4Q09, sources say
[Digitimes]

Aug. 31, 2009 High-end server chips breaking records
[CNET News]

Aug. 24, 2009 IBM's Power7 heats up server competition at Hot Chips
The 4-, 6- and 8-core Power7 drove the need for more memory, a change that took years of effort both in IBM's silicon-on-insulator process technology and in memory architecture. [EE Times]

Jul. 31, 2009 Smaller, cheaper cell phones possible
[PhysOrg.com]

Jul. 28, 2009 MOSIS Marks Expanded Semiconductor Foundry Offerings With Shuttle Runs for Silicon-On-Insulator (SOI)
[MOSIS]

Jul. 28, 2009 NXP Dual Channel Class-D Amplifiers Bring Power Efficient Concert Hall-Like Sound Into the Vehicle
[Business Wire]

Jul. 27, 2009 Cadence Validates ARM Optimized Libraries for 45nm SOI Process
[Cadence]

Jul. 16, 2009 GlobalFoundries outlines roadmap, plans to break fab ground
[EE Times]

Jun. 18, 2009 Thin SOI Devices Shine at VLSI Symposium
[Semiconductor International]

Jun. 9, 2009 Infineon and LS Industrial Systems Form Joint Venture to Forge Ahead in Molded Power Module Business for White Goods; Joint Venture to Accelerate Access to Power Module Market in Korea and Asia
[Infineon]

Jun. 9, 2009 Hynix and Innovative Silicon to Describe Memory Breakthrough at 2009 Symposium on VLSI Technology
[Innovative Silicon]

Jun. 4, 2009 Globalfoundries Demos 28nm, 32nm Wafers
[X-bit labs]

Jun. 3, 2009 Luxtera Announces Production Status of World’s First Commercial Silicon CMOS Photonics Fabrication Process
[Business Wire]

Jun. 2, 2009 AMD Introduces Next Generation AMD Athlon™ II Processor, Adds Dual Core to Record-Setting AMD Phenom™ II Processor Lineup
[AMD]

Jun. 1, 2009 New Six-Core AMD Opteron™ Processor Delivers Up to Thirty-Four Percent More Performance-per-Watt in Exact Same Platform
[AMD]

May. 26, 2009 The Future of GlobalFoundries revealed
[Bright Side Of News]

May. 14, 2009 AMD, Atic construct $4.2bn facility
[Emirates Business 24|7]

May. 7, 2009 GlobalFoundries gears up
[The Tech Report]

May. 5, 2009 AMD smashes the 7.1 GHz barrier with Phenom II 955 CPU!
[Bright Side Of News]

Apr. 9, 2009 CEA/Leti and IBM to Collaborate on Future Nanoelectronics Technology
[IBM]

Apr. 3, 2009 Freescale speeds 45-nm processors to market for next-gen wireless equipment
[Electronic News]

Mar. 13, 2009 IBM Ships 50 Millionth Processor for the Nintendo Wii Game System
[IBM]

Mar. 10, 2009 LogicVision Announces Memory BIST & Repair Solutions for 45nm SOI Foundry Customers
[LogicVision]

Mar. 4, 2009 GLOBALFOUNDRIES, World’s First Global Semiconductor Foundry Opens for Business
[GLOBALFOUNDRIES]

Mar. 3, 2009 GlobalFoundries Launches as U.S. Foundry
[Semiconductor International]

Feb. 9, 2009 Green tech drives ICs beyond silicon
[EE Times]

Feb. 4, 2009 NXP unveils suite of efficient power supply products including GreenChip PFC and SR controllers
[NXP]

Dec. 16, 2008 Smart Cut™ technology inventor honored
[Soitec]

Dec. 15, 2008 MOSIS announces IBM's SOI technology
[EuroAsia Semiconductor]

Nov. 12, 2008 Tech Roundup: IBM Opens Foundry, Sun Partners Microsoft, Server Energy Ratings, More
[BNET]

Nov. 11, 2008 New IBM 45 nm SOI foundry could open new doors for small devices
[BetaNews]

Nov. 10, 2008 Big Push for SOI
[System Level Design Community]

Nov. 10, 2008 IBM’s New Foundry Service Takes on Intel
[GigaOM]

Nov. 10, 2008 ARM Announces Industry’s First Silicon-On-Insulator Physical IP Library For IBM’s New 45nm SOI Foundry
[ARM]

Nov. 10, 2008 IBM Extends Reach of Silicon on Insulator Technology Beyond Traditional High-End Applications
[IBM]

Oct. 10, 2008 Freescale in 45nm SOI production
[ElectronicsWeekly.com]

Oct. 7, 2008 AMD and Advanced Technology Investment Company of Abu Dhabi to Create New Leading-Edge Semiconductor Manufacturing Company
[AMD]