Tag Archive automotive

Two important SOI-related announcements from Chartered

• Two important SOI-related announcements from Chartered. It is licensing IBM ’s 90 nm SOI technology, enabling it to expand the use of the technology to areas such as consumer, multi-media, communications, automotive and industrial applications for foundry customers. And, following the successful manufacturing of 90 nm SOI CPU products for the Xbox 360, Chartered has signed an agreement with Microsoft for manufacturing a 65 nm SOI version of the Xbox 360 CPU.

More Power to You

Philips is building more and more high voltage/power products on SOI. Here’s why.

Since the 1990’s, Philips has been and continues to be a pioneer in SOI-based high-power and high-voltage ICs (handling anywhere from 12 to 800 volts).

Now these chips are everywhere. They’re in smaller, lighter power modules and battery-chargers for a whole host of products, including PC monitors and peripherals, TVs and set-top boxes, DVDs and CD players, consumer electronics, medical equipment and more. Read More

High-Growth GaN Applications Could Get a Boost

Replacing epitaxy with bonding could pave the way for 4” substrates.

Gallium nitride (GaN) based blue-white HB-LEDs (High-Brightness LEDs) are now at full production level, posting a CAGR of over 51% and targeting markets in automotives, IT, and general lighting. Read More

On the Road

To make cars more comfortable, convenient, safe and secure, leading car makers such as DaimlerChrysler, BMW, Ford, GM and VW are using In-Vehicle Networking (IVN) systems that can consist of anywhere from 10 to 100 chips.

The primary IVN networking protocol, Controller Area Network or CAN, is used throughout the car in body, chassis and powertrain electronics. However, CAN, which is also used in a wide array of other industrial applications, assumes good connections and interference-free signals across the network. That’s a real challenge in the hot and electrically noisy world under the hood. You have the risk of physical damage to chips and wires, electromagnetic interference and emissions, high temperatures, plus a limited power supply. Read More