Tag Archive Cissoid

A leader in devices for extreme temperatures (-55°C to +225°C), Cissoid continues rolling out new SOI-based products for power management, power conversion and signal conditioning.

CissoidA leader in devices for extreme temperatures (-55°C to +225°C), Cissoid continues rolling out new SOI-based products for power management, power conversion and signal conditioning. Additions over the last year include:

  • FUJI, a High Reliability 3.5W DC-DC Converter with Triple Output 5V, 3.3V & 1.8V
  • CHT-RIGEL, a High Reliability Adjustable Voltage Regulator for up to 30V input and 100mA output
  • AMALTHEA, a High-Temperature, General Purpose 80V / 3A Dual Diode
  • OPAL, A High-Precision Dual Op Amps for up to 175°C and 225°C Applications.
  • A High-Temperature N-Channel MOSFET Transistor 80V / 1A in a Tiny SMD Package
  • VOLGA, a High-Temperature, High-Speed, Rail-to-Rail Comparator in a Tiny TDFP Package

Cissoid products are used in mission-critical systems as well as in applications requiring long term reliability (most will even operate over a record temperature range of 500°C). The company, which in recent months has also announced additional distribution channels, supplies leaders in the Oil&Gas, Aeronautics, Industrial and Automotive markets.

Microsemi, Honeywell et al Leveraging SOI to Curb CO2 Emissions

The furnace in your home’s basement might not be as sexy as your smartphone, but when it comes to making a difference to the planet, it’s awfully important. That’s why Microsemi and Honeywell have teamed up with Cissoid, Cambridge CMOS Sensors and several top universities like UCL, Cambridge and Warwick in a €4 million ($5.3 million) 3-year European research program called SOI-HITS that’s developing high-temperature smart gas sensors to make furnaces more efficient.

Furnaces? Well, consider that in the average UK home, 85% of the energy consumed is by the boiler (the British term for a home furnace). It turns out there are about 40 million domestic boilers in the EU with a growth rate of 15% per year. This project aims to save 15% in energy consumption in the domestic boiler industry, which will save 3.6 billion Euros per year – a nice ROI.

Sensors in general are a high-growth market – currently growing at 79%, enroute to hit $43 billion in the next two years (per Markets and Markets).

The sensor tech developed in this program can reach far beyond the furnace.  As high-temp specialist CISSOID’s CTO, Pierre Delatte, points out, “Thanks to the results of the SOI-HITS project, high temperature sensors will soon benefit from highly integrated and accurate electronic interfaces, offering unmatched reliability and reducing the cost of ownership in industrial, aerospace and automotive systems.”

To do this, you’ve got to use SOI. Long-time ASN readers will know that high-temp apps were one of the original drivers of SOI decades back, and Honeywell was one of the pioneers.  If you want to understand why SOI is so good for high-temp, Honeywell has a really good, clear explanation here.

SOI-HITS Proposal

(Courtesy: Microsemi and Honeywell)

To reduce both energy consumption and waste gas emissions, the SOI-HITS partners are developing innovative CMOS-compatible, SOI integrated smart microsensor systems, capable of multi-measurement (water vapour, temperature, gas, flow, UV/IR) and detection under harsh environment conditions (to 225oC, high water vapour level).  That means extending operating temperature to a minimum of 175oC (targeting 225oC), extending operation life to minimum 10k hours (targeting 50k hours) – all while reducing the cost of packaging and assembly methods to under $10.

According to the project summary, “The smart multisensor chip will comprise multiple micro-hotplates with tungsten micro-heaters onto which selective nanostructured and thin film metal oxide sensing layers have been deposited. For the gas sensors (CO2 (concentration 6-10%, CO (0-1000ppm), and H2S (0-100ppm)), we will achieve fast thermal response time of a few ms and loss per micro-hotplate below 0.2mW/oC. Water vapour sensors, flow sensors (for liquid & gas) and precision on-chip temperature controllers will be also integrated. On-chip processing electronics, including drive circuitry, filters, amplifiers, processing circuits and analogue to digital interfaces, operating at 225oC, will be developed. The extension of the SOI platform to optical detectors, such as UV photodiode flame detectors and IR combined sources/detectors, will be explored. Finally development of a High Temperature SIP (system in a package) will enable real-world demonstrators.”

The program finishes up next year, but this summer the partners presented an update during a workshop at the Transducers conference in Barcelona.  The presentations are all available here.

It’s very cool (or hot!) stuff. And good for the planet.

Spotlight on FD-SOI & FinFETs at Upcoming IEEE SOI Conference
(1-4 Oct. in Napa – register by 17 Sept. for best rate)

The 38th annual SOI Conference is coming up in just a few weeks. Sponsored by IEEE Electron Devices Society, this is the only dedicated SOI conference covering the full technology chain from materials to devices, circuits and system applications.

Chaired this year by Gosia Jurczak (manager of the Memories Program at imec), this excellent conference is well worth attending. It’s where the giants of the SOI-related research community meet the leading edge of industry. But there are also excellent courses for those new to the technology. And it’s all in an atmosphere that’s at once high-powered yet intimate and collegial, out of the media spotlight.

Meritage Resort and Spa in Napa Valley

The 2012 IEEE SOI Conference will be held October 1-4 at the Meritage Resort and Spa in Napa Valley, California.
(Photo Credit: Rex Gelert)

This year it will be held 1-4 October at the Meritage Resort and Spa, a Napa Valley luxury hotel and resort, set against rolling hills with its own private vineyards. Finding the right spot for this conference is key. One of the things that people really like about it is that in addition to the excellent speakers and presentations, the locations are conducive to informal discussions and networking across multiple fields. This year’s spot looks like the perfect setting, with easy access to Silicon Valley.

The Conference includes a three-day Technical Program, a Short Course, a Fundamentals Class, and an evening Panel Discussion. Here’s a look at what’s on tap for this year.

(To register at the discounted rate, be sure to send in your registration by September 17th. You can get the pdf of the full program & registration information from the website.)

The papers

ARM’s SOI guru Jean-Luc Pelloie chaired this year’s Technical Program committee, which selected 33 papers for the technical sessions. There will also be 18 invited talks given by world renowned experts in process, SOI device and circuits design and architectures and SOI-specific applications like MEMS, high temperature and rad-hard.

Here’s a rundown of the sessions:

  1. Plenary: talks by Soitec and ARM
  2. FullyDepleted SOI: topics include Ground Plane Optimization for 20nm, strain, process & design considerations. GF will present the foundry’s perspective on the move to 28nm FD-SOI and beyond. Also contributors from ST, Leti, Soitec, IBM, GSS/U.Glasgow and more.
  3. FinFET and Fully Depleted SOI: topics include Tri-Gate, SOI-FinFET, Flash Memory, strain solutions, flexible Vth. Contributors include Leti, AMD, Soitec, Synopsys, imec, UCL, AIST and UCBerkeley.
  4. Poster session: from universities & research institutes supported by industry (IBM, Samsung, etc.)
  5. RF and Circuits: topics include high-performance RF, tunable antennas, TSVs. Contributors include Skyworks, ST, Xilinx and leading universities in China.
  6. Memory: contributors from IMEP, ST, TI, R&D institutes and academia
  7. Novel Devices and Substrate Engineering: topics include nanowires, strained SOI wafers and III-V devices, with contributions from Tokyo Tech, Toshiba, IBM, Soitec, Leti and more.
  8. MEMS and Photonics: includes an invited talk by U. Washington on their Intel-sponsored photonics foundry service and papers from MIT and more.
  9. RF and Circuits: covering high-voltage, high-temperature, with contributions from Cissoid, IBM, UCL and more.
  10. Hot Topics: FullyDepleted Technology and Design Platforms: six invited talks by ST, IBM, CMP, GF, UC Berkeley and the SOI Consortium.
  11. Late News: tbd, of course…

The courses & panel

Short course: Design Enablement for Planar FD & FinFET/Multi-gates (chaired by UCL & Leti) The conference kicks off on Monday with six sessions by experts in technological trends, the physics of fully depleted devices, technology design kits as well as digital, analog and RF designs specific for FD-SOI.

The fundamentals course: FinFET physics (chaired by Intel): on Wednesday afternoon, three hour-long sessions will give comprehensive insights into the physics and processes related to multi-gate FETs.

Panel: Is FinFET the only option at 14nm? (chaired by Soitec) Following the always-popular Wednesday evening cookout, the panel discussion is a lively favorite event. This year’s invited distinguished experts will share their views on the industry’s FinFET roadmap.

All in all, it’s a great event. If you go, why not share your impressions on Twitter with #SOIconf12, @followASN and @IEEEorg? And of course ASN will follow-up with summaries of the top papers in our PaperLinks section. See you there?

High-temp SOI specialist Cissoid has introduced Moon, a new 40V N-channel MOSFET transistor that can switch currents up to 2A

High-temp SOI specialist Cissoid has introduced Moon, a new  40V N-channel MOSFET transistor that can switch currents up to 2A. At 225°C, the gate leakage current remains below 100nA, while its drain off current doesn’t exceed 3.5μA.

Cissoid is adding new SOI-based products to its portfolio

Cissoid is adding new SOI-based products to its portfolio of high-temperature components almost every month, including mixed-signal and telemetry chips, a wide range of drivers and more.

Cissoid further extends its lines of SOI-based products

Cissoid further extends its lines of SOI-based products for high-temperature environments with a DC-DC converter platform, fast drivers for power transistors, and power MOSFETs.

New high-temperature, SOI-based products from Cissoid

New high-temperature, SOI-based products from Cissoid:

With the CHT-NMOS40, system designers can improve cost, reliability and weight while eliminating fluid cooling from applications such as industrial process control, car battery chargers and aircraft actuators.

  • The new CHT-NMOS40 family of High Temperature 40V N-channel power MOSFET Transistors, enabling the design of any system requiring reliable power control in a harsh environment from -55°C to +225°C.
  • Vesuvio, the world’s first 225°C DC-DC converter platform for high reliability and electric vehicle applications.
  • Hyperion, a high temperature driver for power MOSFETs in DC-DC converters and electric motor control motor drivers and inverters, especially for the transportation industry (electric and hybrid cars, train, aeronautics) and oil & gas applications.
  • Magma, a high temperature Pulse Width Modulation (PWM) controller for DC-DC converters and Switching Mode Power Supplies (SMPS).

Cissoid has announced its CHT-74 Logic Family for Extreme Temperatures

(Courtesy: Cissoid)

Cissoid has announced its CHT-74 Logic Family for Extreme Temperatures. The products are optimized for high-temperature and high-reliability applications, with a very large temperature range (-55°C to 225°C). Target markets include Oil & Gas, Aeronautics, Space and Automotive.

Tony Denayer New CEO at Cissoid

With a new CEO, new round of funding, and new product, customers and distribution, Cissoid is on a roll.

Tony Denayer, CEO and Director, Cissoi

Cissoid has announced the appointment of Tony Denayer as CEO and Director. He joins the company from AMI Semiconductor.

Cissoid recently completed a second round of investment with initial investors (VIVES, SRIW and Soitec). An SOI pioneer, the company plans to confirm its position as a reference supplier in the high-temperature electronics market, and to expand the product portfolio and sales channels. A leader in oil & gas and aerospace, Cissoid is now looking to enter other markets such as automotive, medical and industrial applications that need reliable solutions in conditions exceeding 150°C. Read More

SOI-based Electronics for Avionic & Space Harsh Environments

SOI-based ICs developed by CISSOID for extreme conditions are reaching record operating temperatures.

The electronics used in Avionics & Space are subject to very harsh conditions, in particular very wide operating temperature ranges. In avionics, the sensors placed close to the engine are subject to very high temperature, well above 200°C, and airplane manufacturers are now specifying the operating of the electronics down to -60°C. Read More