Tag Archive IBM

ByGianni PRATA

Xbox® 360 Debuts New Gaming Generation

Microsoft’s custom PowerPC chip by IBM is based on SOI

 

Microsoft’s Xbox 360, which is expected to fly out of the stores this holiday season, has some very impressive figures to cite. The three-core PowerPC-based CPU, custom-made for Microsoft by IBM, boasts one teraflop of floating-point performance. Read More

ByGianni PRATA

IBM has started shipping its new System z9 mainframe line

• IBM has started shipping its new System z9 mainframe line, the first of a new generation of mainframes based on CMOS 10S-SOI technology.

ByGianni PRATA

Following the premier of its Xbox 360 TM video game and entertainment system

• Following the premier of its Xbox 360 TM video game and entertainment system, Microsoft confirmed that the unit is built around an IBM PowerPC-based CPU with three symmetrical cores running at 3.2 GHz each. The latest IBM PowerPC process technology integrates strained silicon and SOI. The new xBox will hit the stores in time for the 2005 holiday season.

ByGianni PRATA

IBM will offer new design services

IBM will offer new design services to help companies integrate the SOI-based Cell technology into a wide range of electronics products – especially image-intensive applications in the aerospace, defense, industrial and medical segments.

ByGianni PRATA

IBM’s SOI Power

IBM is reaping the benefits of its long SOI history.

In 1998, IBM announced that after years of research, it had “perfected” SOI, and would incorporate it into custom and standard products. “We believe SOI, with its high- performance and low-power characteristics, is a significant breakthrough in chip technology,” said Mike Attardo, General Manager, IBM Microelectronics at the time. “Like our copper chips, SOI will accelerate the industry’s constant drive to create smaller, more powerful, less expensive electronic goods.” Prescient words. Read More

ByGianni PRATA

Pilot production of Chartered Semiconductor

Pilot production of Chartered Semiconductor Manufacturing’s first 300-mm facility includes the 90nm SOI process tuned to IBM’s high-performance product needs.