2019 will be a busy fall for the SOI Consortium and our members.
First off are the SOI Consortium events in Shanghai and Tokyo, which are very popular indeed. We now have the dates & locations locked in, so you’ll want to mark your calendars:
The SOI Consortium and members will also be giving talks at Semicon Europa, which is being held 13 – 15 November 2019 in Munich, Germany.
The programs are currently being finalized. As soon as they’re ready, we’ll be sure to let you know so you can register and/or share the news with your colleagues and clients. But in the meantime, make sure you save the dates.
Would you like to check out the presentations given at Consortium events in previous years? If you hover your cursor over the Events tab at the top of our home page, you’ll get a drop-down menu of events for the last five years (we’re working on adding more – we’ve been doing these events for over a decade!). Click through to any past event and you’ll land on a page where you can download most of the presentations that were given there. Of if you’re looking for past presentations given by any particular company, use the search engine at the bottom of any page on our website.
You’ll also find many of our members at the IEEE/EDS S3S Conference in San Jose, CA, October 14 – 19th. S3S (formerly known as The SOI Conference) has been running in various forms for over 30 years. They always have an excellent line-up of speakers, plus it’s a great opportunity for networking with researchers from across the worldwide SOI ecosystem. BTW, while the deadline for general paper selection has already closed, papers of exceptional merit are currently being accepted for their Late News Sessions. See the 2019 Call for Papers for more information – those Late News papers need to be received by 23 August 2019 for consideration.
Also, IEEE S3S Conference will once again host a full-day short course and a half day tutorial. These are very popular. The short course this year will be on SOI Design and Technology for Analog and Mixed Signal. As of this writing, the program is still being finalized, but more will be announced in the next few weeks, so check back on their website soon for updated information.
And finally, don’t forget to learn more about the offerings from and in support of the SOI ecosystem at our members’ events around the globe, including:
RF-SOI is in every smart phone out there, and with 5G, there are lots more applications on the horizon. If you’d like to learn more about designing in RF-SOI, there’s a great short course coming up the day before and in conjunction with the EuroSOI-ULIS Conference in Granada, Spain.
The title of this short course is RFSOI: from basics to practical use of wireless technology. Program and registration details can be found here. The course runs for the full day on Sunday, 18 March 2018.
The talks, which are being given by a stellar line-up of experts, include:
BTW, this year marks the 4th joint EUROSOI – ULIS Conference. The EuroSOI Conference, which has been ongoing for decades, is well paired with the ULtimate Integration on Silicon Conference. The joint conference provides an interactive forum for scientists and engineers working in the field of SOI technology and advanced nanoscale devices. One of the key objectives is to promote collaboration and partnership between different players from academia, research and industry. As such, it covers technical topics, industry trends and updates from pertinent European programs.
EuroSOI-ULIS will take place 19–21 March 2018 at the University of Granada in Spain. For information on the program and how to register, see the website. Following the conference, the papers will be available at the IEEE Xplore® digital library, and the best papers will be published in a special issue of Solid-State Electronics.
Name a top Silicon Valley company, and you’ll probably find it on the attendance list of the upcoming FD-SOI & RF-SOI Forum in San Francisco. At the time of this posting, people from over 65 companies are among the hundreds who’ve signed up for this free, all-day event.
If you haven’t yet, you can still sign up at the SOI Consortium Website – just click here to go there. This event’s being sponsored by ARM, GlobalFoundries, ST, Synopsys, SunEdison, SEH and Soitec. Cadence, Ciena, GlobalFoundries, IBM, IMEC, Samsung, STMicroelectronics, Synopsys and VeriSilicon will present compelling solutions about FD-SOI and RF-SOI technologies, including competitive comparisons and product results.
Here’s a preview of the day. The morning’s devoted to FD-SOI, and the afternoon’s all about RF-SOI. Plus, there’s a (yes, free!) lunch, and a chance to network during the coffee breaks and over wine & cheese at the end of the day.
FD-SOI foundry offer
FD-SOI IP offer
FD-SOI design experience
Advantages and opportunities when designing with FD-SOI — Moderator: Dan Nenni, SemiWiki
If you’re in San Francisco for ISSCC (22-26 February), the FD-SOI/RF-SOI is a seven-minute walk up the street the next day. But if you can’t get to SF, don’t worry – you’ll get summaries of all the talks here at ASN. Access to the complete presentations will be freely available on the SOI Consortium website a few days later.
This workshop is part of a continuing series organized by the SOI Consortium. If you missed the recent ASN coverage of the event in Shanghai this fall, you can read about the FD-SOI part here, and the RF-SOI part here. For coverage of the Tokyo event in December, click here to read about the big Sony FD-SOI presentation and EDA/IP presentations and more here, and the Samsung, ST and other presentations here. You can also download most any of the presentations from all of the workshops that have been held over the last five years here.
For the SF event – here’s the key information:
FD-SOI and RF-SOI Forum
For the first time ever, Semicon Europa will be held in Grenoble this year, and FD-SOI will be a major part of it (website link here). With more than 5000 visitors and 350 exhibitors, Semicon Europa is the greatest annual event for the European microelectronics industry.
And Grenoble can fairly be considered the epicenter of all things SOI: it really took off when Leti researcher Michel Bruel invented the Smart CutTM technology there for manufacturing SOI wafers in the early 1990’s. That was then spun off to Soitec up the road, and the rest is history in the making. In fact, Forbes recently recognized Grenoble as one of the Top 5 Most Inventive Cities in the world.
So from now on, Semicon Europa will alternate between Dresden, Germany (home to GlobalFoundries’ fabs) and Grenoble, France.
Happily this is coinciding with an industry upturn, so Semi’s signed up 25% more exhibitors than last year. In addition to the exhibition floor, the 3-day event will also host over 300 speakers at over 70 conferences and more than 100 hours of technology sessions and presentations. This is no longer your quiet Euro-equipment show – this is a dynamic happening covering the entire supply chain, with a big emphasis on innovation and applications.
For those attending the popular Fab Managers Forum, the opening keynote will be made by Soitec founder and CEO André-Jacques Auberton-Hervé. In addition to heading up the world’s largest SOI wafer manufacturer, Dr. Auberton-Hervé is a member of the EC’s High-Level Group on Key Enabling Technologies (KET) and of the Electronic Leaders Group (ELG), which is in charge of implementing the European Union’s “10/100/20” strategy (they’re looking to leverage €10 Billion Public/Private Funding for a €100 Billion investment from industry for manufacturing to capture 20% of the semiconductor market value for Europe by 2020). As we reported here in ASN earlier this year, SOI-based apps are an important part of all this.
In the abstract for his Semicon presentation, Dr. Auberton-Hervé indicates he’ll describe the ELG implementation plan focused on demand accelerators (IoT, mobile convergence), supply chain strengthening, and an enhanced framework development across Europe. The Pilot Lines initiative was started in 2012, and industry is ready to invest now, he notes, with 5 pilot lines in progress, and numerous projects submitted. He’ll highlight how manufacturing performance is key in the European semiconductor industry, from materials and equipment to components design and wafer production.
FD-SOI at the Semicon Europa Low Power Conference
The key Semicon Europa event for the FD-SOI ecosystem will be The Low Power Conference, which features a cast of heavy hitters (abstracts for the talks and speaker bios are available here.) It kicks off on Tuesday afternoon (7 September) with a market analysis by ST COO Jean-Marc Chery, exploring solutions for mobile to servers and IoT.
Next up, Manfred Horstmann, GlobalFoundries’ Director of Products and Integration in Dresden will focus on SOCs for at 28/20nm. He’s using the term “ET-SOI” with BB (back bias) options. The ET stands for Extremely Thin SOI – it’s the term IBM first used for FD-SOI, but the two terms are now used seemingly interchangeably. As Horstmann notes in the conference abstract, “Being a planar device, ET-SOI devices allow the continuation of previous nodes manufacturing and design experience. Vt-tunability and low GIDL currents are a clear advantage of ET-SOI BB devices for SoC applications, too.” He’ll conclude with an outlook on FinFETs.
Thomas Skotnicki Fellow and Director of Advanced Devices at STMicroelectronics and all around giant of FD-SOI (and in particular ST’s flavor: ultra-thin box and body aka UTBB) has what sounds like a groundbreaking IoT talk. Beyond FD-SOI, he’ll cover how the technology will be used in conjunction with energy harvesting, storage, power management, sensors and MEMS. He’s got a low-power mobile app example to show us, too.
David Jacquet of ST will address design, showing among other things how FD-SOI opens the way to new opportunities like Wide DVFS and dynamic leakage management. He’ll be detailing the key IP for implementing those technologies. (He’s got a great video on FD-SOI design techniques, btw – click here for more on that.)
Soitec CTO Carlos Mazure will cover the range of substrate solutions for devices across the mobile space, including RF, FD-SOI and SOI FinFET.
Wednesday morning, the conference continues with more from ST, and a must-see talk on FD-SOI and IoT costs and projections by Handel Jones of IBS. (If you’ve missed his excellent pieces here in ASN, you’ll find them all here.)
The rest of the afternoon will focus on design tools and applications, with talks from Cadence, ANSYS, Docea, HP (two talks from them), Ericsson, Schneider and Sorin (medical devices).
ASN will be there – follow us on Twitter for live coverage – and we’ll bring you more details of the key talks in the weeks to come.
Power and 3DI
A couple of other last notes if you’re planning a trip to Semicon Europa. On Wednesday afternoon (8 September), a 3D Integration Session (details here) will cover recent updates on 3D circuit and process technologies. Following an introduction by Ionut Radu, Soitec Senior Scientist, speakers from TSMC, imec, Leti, EV Group, Entegris, Fujifilm and Rockwood will address the status of 3D circuits, including 3D TSV and monolithic 3D integration schemes, manufacturing challenges and readiness for application specific systems.
Another terrific Semicon Europa event for the advanced substrates community will be the Power Electronics Conference: the ultimate path to CO2 reduction. Topics cover GaN, GaN-on-Si, SiC and SOI. Renault, Leti, Schneider Electric, ST, Infineon, Yole, Fairchild, and Siltronic will be presenting, as well as Arnaud Rigny of Soitec, who’ll will give a talk on smart substrates for smart power. This all takes place on Wednesday and Thursday, the 8th and 9th of September. Details can be found here.
Hope to see you in Grenoble!
imec’s 28Gb/s silicon photonics platform for optical interconnects and other optical applications will be included in an upcoming multiproject wafer run, reports R. Colin Johnson in EETimes (read the article here). These runs, which are on SOI wafers, are a joint effort by ePIXfab (founded by imec and Leti), Europractice IC and MOSIS. They provide a cost-effective vehicle for fabless researchers in data and telecom.
2014’s going to be a terrific year for the greater SOI community, with 28nm FD-SOI ramping in volume and 14nm debuting, plus RF-SOI continuing its stellar rise.
But before we look forward (which we’ll do in an upcoming post), let’s consider where we’ve been and some of the highlights of the last year. In fact, there was so much happening that we’ll review 2013 in two posts – this post is about FD-SOI; in the next post we’ll cover RF-SOI and FinFETs.
Highs, lows, and the promise of an extra day
It was just a year ago that you read in the first ASN post of 2013 about ST-Ericsson’s NovaThor™ L8580 ModAp: at 2.5GHz it was “the world’s fastest and lowest-power integrated LTE smartphone platform” at CES ’13 in Las Vegas. Then in February in Barcelona ST announced that its 28nm FD-SOI technology clocked in at 3GHz, but what was really amazing was that it got 1GHz using using just 0.6V VDD, aka the “supply voltage”, which is the main voltage “in” that powers the chip. No one had been able to run stably on that low a voltage before. 28nm FD-SOI got you a full extra day before you had to recharge your device.
But then of course came the sad news that the plug was pulled on ST-E. Happily the technology moved into the ST fold, and the 28nm process is now ramping in volume, with 14nm is set to debut shortly.
May was a big month. ST’s FD-SOI got the EETimes ACE Award for Energy Technology – and the company announced it had started winning FD-SOI customers. We also got the news of a big public-private funding boost, to the tune of €360M, for the Places2Be project (which stands for Pilot Lines for Advanced CMOS Enhanced by SOI in 2x nodes, Built in Europe). It is lead by ST, with production lines in Dresden and Grenoble. Among the other companies and institutions involved are GlobalFoundries, Soitec, Mentor, Leti, imec, Ericsson and UCL. A 3-year public-private project involving 500 engineers from 19 members in seven countries, it’s looking to enable volume manufacturing in Europe from 28nm down to 10nm.
Also in May, Leti told us that they’d gotten silicon layers down to 3.5nm, and for boosting pFETs with SiGe, were seeing better results with FD-SOI than bulk FinFETs. What’s more, they found that the advantages of back-biasing increase as you shrink the SOI layers, so it will get even better with each node!
In August, the French government upped the ante with a 600 million Euro investment in the Nano2017 program, which was in addition to the 3.5 billion Euros that ST and partners had already pledged, bringing the total to 4.1 billion Euros (about $5.4 billion).
In October, Leti said it would have the 10nm FD-SOI PDK ready in June of 2014.
In November, the wafer supply chain got a boost when SOI wafer suppliers Soitec and SunEdison (formerly MEMC) ended their longstanding legal feud and entered into a patent cross-license agreement.
At IEDM in December Leti announced UTSOI2, a compact model for electrical simulations. Compact models of transistors and other elementary devices are used to predict the behavior of a design. As such, they are embedded in simulations like SPICE that designers use before they run silicon. Dedicated to Ultra-Thin Body and Box (UTBB) FD-SOI technology, UTSOI2 accurately describes independent double gate operation for sub-20nm nodes. Also at IEDM, ST, Leti, IBM, Renesas, Soitec and GlobalFoundries presented the big paper showing great results for 14nm FD-SOI.
So 2014 promises to be an excellent year. Stayed tuned – next up we’ll review the great strides made in RF-SOI and SOI-FinFETs.
From all of us here at ASN, wishing you a safe, happy, healthy, prosperous and innovative New Year!
MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs. The partnership gives MOSIS’ customers access to imec’s state-of-the-art fully integrated silicon photonics processes and Tyndall’s advanced silicon photonics packaging technology. Co-founded by Leti and imec in 2009, ePIXfab offers a cost-effective way for researchers and small and medium sized companies to prototype photonic integrated circuits on SOI.
Dr. Jean-Pierre Colinge received the 2012 IEEE Andrew S. Grove award at the last ESSDERC-ESSCIRC Conference, for his “contributions to silicon-on-insulator devices and technology.” One of the industry’s most prestigious, the Grove Award is sponsored by the IEEE Electron Devices Society, recognizing “outstanding contributions to solid-state devices and technology.” As noted in the EDS Newsletter, Dr. Colinge’s “…strong actions and enthusiastic beliefs were crucial for supporting the development of SOI technology.” One of the giants of the SOI community, Dr. Colinge is especially heralded in the industry for his seminal and continued work in multigate FETS (aka MuGFETs, a category that includes architectures such as FinFET and TriGate among others). Dr. Colinge and his work have been featured in many editions of ASN. Previous Grove winners with strong ties to the advanced substrate community include Bijan Davari (IBM, 2010) and Dimitri A. Antoniadis (IBM, 2002).
The FD-SOI design and manufacturing ecosystem has just gotten a €360M boost. A new 3-year public-private project involving 500 engineers from 19 members in seven countries is looking to enable volume manufacturing in Europe from 28nm down to 10nm. The Places2Be project (which stands for Pilot Lines for Advanced CMOS Enhanced by SOI in 2x nodes, Built in Europe) is lead by ST, with production lines in Dresden and Grenoble. Among the other companies and institutions involved are GlobalFoundries, Soitec, Mentor, Leti, imec, Ericsson and UCL.