Tag Archive SiC

Semicon Europa ’14 (Grenoble, 7-9 October) Includes Top Speakers at Conferences on Low Power, 3DI, Power Electronics & more

(Image courtesy: SEMI)   For the first time ever, Semicon Europa will be held in Grenoble this year, and FD-SOI will be a major p

Composite Substrates Promise Boost for GaN RF

Results of the HYPHEN project indicate a new path to high-volume, high-power, and high-frequency wireless applications. The European HYPHEN GaN-

Innovation Accompanies Steady Growth In Power Devices

The power devices market may be small, but it has a strong tradition of pioneering important advanced technologies. Within the microelectr

New Options for GaN RF

Smart Cut™ enables innovative substrate solutions GaN HEMT technology holds enormous promise for increasing the power of commercial RF a