In January of this year, Soitec announced its participation as the SOI substrate supplier in an ATDF development program focusing on multi-gate field effect transistor (MuGFET) technology for the 45-nm node and below. Soitec has now presented joint papers with Texas Instruments and Infineon Technologies at various technical conferences on MuGFETs, which are promising non-planar CMOS transistors that improve performance and minimize current leakage •
Now in its third year, Soitec’s Characterization Lab in Bernin proposes a whole battery of electrical and physico-chemical tests such as Psi-Mos, Hg-fet, CV, Box integrity, BMD and SECCO on SOI, sSOI and new materials. R&D researchers in the lab are developing new characterization techniques for future needs. The lab is audited regularly by customers, and is ISO 9001/14001 compliant •
A new book, SOI Device Technology by Makoto Yoshimi, PhD, covers the history of SOI, the floating body effect and a variety of LSI applications.
An SOI pioneer (he began his research over 20 years ago for Toshiba), Makoto Yoshimi is now Chief Scientist of Soitec Asia. “This book describes what SOI is all about”, he says, “and provides an introduction for device engineers and graduate students.”
Dr. Shigeto Maegawa of Renesas Technology Corp. (Japan) notes that the book “…captures the enthusiasm of the engineers who worked so tenaciously to make SOI a reality.” •
Here’s a quick review of some recent Smart Cut activity.
Soitec announced that its Smart Cut technology was used to split and transfer a thin layer of GaN from a high-quality GaN donor wafer onto a carrier wafer— generating the world’s first single- crystal, thin-film gallium nitride (GaN)-on-insulator substrate. This represents a critical step forward in enabling the development of high-performance blue and white light-emitting diodes (LEDs), as well as for improving current and future device performance in radio-frequency (RF) and discrete power applications Read More
According to a recent report in “SST” magazine, the Silicon Valley-based market research firm Strategies Unlimited is projecting substantial growth for the gallium nitride (GaN) market. Worth $3.2 billion in 2004, the market is expected to increase to $7.2 billion over the next five years, making it one of the most successful compound semiconductor materials. The report, entitled “Gallium Nitride 2005 – Technology Status, Applications, and Market Forecasts”, says that white LEDs account for over half of the GaN-related LED market. It also sees big growth coming Read More
The reticle used for this wafer is a 45nm technology test vehicle. Lithography was done using a 193nm wavelength scanner. Devices are made on a Soitec™ UNIBOND™ SOI wafer (88nm Si thickness / 145nm BOx thickness).
The reticle was designed to print fins down to 30nm fin width and it incorporated various capacitors, NMOS/PMOS/CMOS transistors (planar & non-planar), ESD structures, Kelvin structures and various test circuits (Ring Oscillators, loaded gates, Current Mirrors, OP-AMPs, SRAM cells, and reliability test sites). Read More