• SOI has made Hitachi’s newest”µ-Chip” the world’s smallest, thinnest RFID IC chip ever. SOI prevents interference between devices, enabling higher integration on a smaller area, increasing the number of chips fabricated on a single wafer and increasing productivity by more than four times. At 7.5-µm thick, this SOI-based chip is 1/8th the thickness of its bulk predecessor. This was achieved by the complete removal of the silicon layer on the reverse side of the SOI substrate on which the circuit is fabricated.
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