The new manufacturing facility will support the region’s 300mm SOI-based markets.
The “Linking of Hands” during the opening ceremony for Soitec Singapore Pte. Ltd.
Left to right: Paul Boudre, COO, Soitec Group; His Excellency Pierre Buhler, French Ambassador to Singapore; Guest of Honour Mr Lim Hng Kiang, Singapore Minister for Trade and Industry; Dr. André-Jacques Auberton-Hervé, President and CEO, Soitec Group; Dr. Emmanuel Arene, CEO Singapore Pte. Ltd. and Industrial Operations EVP, Soitec Group
Following a gala ceremony, Soitec has officially opened its newest 300mm SOI wafer manufacturing facility. Dubbed Pasir Ris 1 and located in Singapore, it is the company’s first wafer fab in Asia.
Pasir Ris 1 is a fully automated, state-of-the- art facility. Built on a 2.7-hectare site, it has more than 4,000 square meters of clean-room space. Total investment is expected to be approximately 350 million Euros at full capacity.
The new fab currently employs more than 100 people. Upon the market’s upturn, it’s designed to facilitate a swift ramp, up to a final capacity of one million wafers per year and a workforce of 500 people.
In addition to supplying SOI wafers for the game console chips produced in the region, this factory will support the region’s use of SOI wafers in other high-volume consumer products.
Pasir Ris 1 represents a strategic part of the Soitec Group’s investment plan to expand worldwide production capacity, and forge closer relationships with customers worldwide.
Customers have been receiving samples for qualification from the first production lines of Pasir Ris 1 for several months now. Feedback has been very positive.
“The construction has taken advantage of the newest manufacturing technologies.”
Emmanuel Arene, CEO
Soitec Singapore Pte. Ltd
Soitec’s strategic investments in the Pasir Ris fab have accelerated the implementation of a complementary wafer recycling process. This contributes to a key cost-reduction objective.
As with Soitec’s other manufacturing facilities, the SOI wafers in Singapore are fabricated using Soitec’s patented Smart Cut™ process. Under this process, silicon is sliced off a “donor” wafer with atomic precision and bonded onto another wafer. The donor wafer is then “refreshed”, enabling it to be re-used and refreshed again multiple times.
With Pasir Ris 1, this key “refresh” step is now integrated in the manufacturing line.