IBM & Soitec team up on wafer-level 3D Integration
Soitec and IBM are collaborating to accelerate 3D integration technology at 22nm and beyond. Soitec will leverage its Smart Stacking™ technology and all of its wafer-level bonding expertise including oxide-to-oxide and metal-to-metal molecular bonding — developed in collaboration with CEA-Leti.
Vision for an optically connected 3-D supercomputer chip
(Courtesy: IBM Research)