Ultrathin SOI as a platform for nanostructures
H.C. Floresca (U. Texas)
Wafer Level 3D Integration of ICs using the temporary and direct bonding and back side thinning
B. Charlet (Leti)
Evolution of polysilicon morphology after direct wafer bonding in PSOI Application
R. Feilleux (Soitec)
Thin single crystal layers of LiTaO3 and LiNbO3 obtained by the Smart Cut™ technology for next generation of innovative substrates
J.-S. Moulet (Soitec)
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