IBM will produce Micron’s Hybrid Memory Cube (HMC) in the debut of the first commercial, 3D chip-making
Posted date : Dec 12, 2011

IBM will produce Micron‘s Hybrid Memory Cube (HMC) in the debut of the first commercial, 3D chip-making. HMC parts will be manufactured at IBM’s advanced semiconductor fab in East Fishkill, N.Y., using the company’s 32nm SOI HKMG process technology.