IBM will produce Micron’s Hybrid Memory Cube (HMC) in the debut of the first commercial, 3D chip-making
IBM will produce Micron‘s Hybrid Memory Cube (HMC) in the debut of the first commercial, 3D chip-making. HMC parts will be manufactured at IBM’s advanced semiconductor fab in East Fishkill, N.Y., using the company’s 32nm SOI HKMG process technology.
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