SOI and other advanced substrate based technologies will be significant beneficiaries of the European Commission’s “New European Industrial Strategy for Electronics”, targeting the mobilization of €100 billion in new private investments. In addition to the recently announced €360M FD-SOI Places2Be project (which stands for Pilot Lines for Advanced CMOS Enhanced by SOI in 2x nodes, Built in Europe), other projects announced by the ENIAC JU* include:
As European Commission Vice President Neelie Kroes said, “I want to double our chip production to around 20% of global production. […] It’s a realistic goal if we channel our investments properly.”
*The ENIAC Joint Undertaking (JU) is a public-private partnership focusing on nanoelectronics that brings together ENIAC Member/Associated States, the European Commission, and AENEAS (an association representing European R&D actors in this field). The document providing details on the pilot line projects is available here.