The world’s largest maker of silicon wafers, Shin‐Etsu Handotai (SEH) says it’s meeting the specs for FD-SOI wafers, and can quickly expand capacity to meet rising demand.
SEH, a $12.7 billion company supplying over 20% of the world’s bulk silicon wafers, has been making SOI wafers since 1988. In 1997, SEH introduced SOI wafers produced using Soitec’s Smart CutTM technology. (Soitec is the world leader in SOI wafer production.) Last year, the two companies extended their licensing agreement and expanded their technology cooperation.
The specs for FD-SOI wafers are very exacting. As Soitec has pointed out, required silicon uniformity across a full 300mm-diameter wafer corresponds to about 5mm (less than a quarter of an inch) over the distance between Chicago and San Francisco.
Here’s what SEH is saying:
Presentations from the Kyoto FD-SOI workshop – including an excellent short course on FD-SOI design techniques – are now freely available on the SOI Consortium website.
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