Fraunhofer scientists have developed a new type of high-temperature SOI-based process for making extremely compact chips that withstand temperatures of up to 300 degrees Celsius (press release here). At a characteristic dimension of 0.35 µm, they are considerably smaller than the high-temperature chips available today, they say. Targets include oil production and geothermal power applications. “It becomes possible with this process to fabricate extremely compact microchips that operate flawlessly even at temperatures of up to 300 degrees Celsius,” said Holger Kappert, head of High-Temperature Electronics at Fraunhofer IMS.
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