IEEE International
SOI-3D-Subthreshold Microelectronics Technology Unified Conference
6-9 October 2014
Westin San Francisco Airport, Millbrae, CA
The IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (IEEE S3S) is welcoming papers until May 26, 2014 (click here for submission guidelines).
Last year, the first edition of the IEEE S3S conference, founded upon the co-location of the IEEE International SOI Conference and the IEEE Subthreshold Microelectronics Conference was a great success with a 50% increase in attendance.
The conference will, this year again, hold two parallel sessions related to SOI and Subthreshold Microelectronics supplemented by a common session on 3D integration.
The 2014 edition of the conference already promises a rich content of high-level presentations.
The plenary session will host Alice Wang (MediaTek), Bruno Terkaly (Microsoft) and Mark Edelstone (Morgan Stanley Investment Banking). They will give us a broad overview of the new markets and opportunities for the upcoming years.
Invited speakers from major industries (like GlobalFoundries, SEH, ST, IBM, Rambus) and from many prestigious academic institutions will share with us their views of the ongoing technical challenges related to SOI, Sub-VT and 3D integration. The complete list of invited speakers can be seen on the program outline page of the conference website.
On the same webpage, more information is given about the various dedicated sessions.
There will be two short courses again this year: One on Power Efficiency, and the other on Monolithic 3D. There will also be a class on RF-SOI Technology Fundamentals and Applications as well as a fundamentals class on Robust Subthreshold Ultra-low-voltage Design of Digital and Analog/RF Circuits.
The Hot Topics session will, this year, be about MEMS. During the Rump session we will debate about the Cost and Benefit of Scaling Beyond 14nm.
The Committee will review papers submitted by May 26 in the three following focus areas of the conference:
Students are encouraged to submit papers and compete for the Best Student paper awards, sponsored by Qualcomm. Details on paper submission and awards are given on the call for paper webpage.
The 2014 edition of the conference will be very conveniently located in Millbrae, California, close to the San Francisco airport. The BART and Caltrain stations, within walking distance, give you access to San Francisco to the north and the Silicon Valley to the south. Conference attendants will be able to easily combine their trips with visiting colleagues in the Bay Area or touring the Golden City.
Paper submission deadline: 26 May 2014
Notification of acceptance: 23 June 2014
Short course date: 6 October 2014
Conference date: 6 – 9 October 2014
More details are available on the S3S website.
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