Soitec receives Sony’s Best Partnership Award for its support with RF-SOI substrates
Posted date : Oct 17, 2014

(Courtesy: Sony and Soitec)

(Courtesy: Sony and Soitec)

SOI wafer leader Soitec was awarded the Best Partnership Award by Sony Semiconductor. Soitec earned the recognition for outstanding support that has contributed to Sony’s success in the RF semiconductor market.

Soitec’s high-resistivity silicon-on-insulator (HR-SOI) wafers have long been a favorite of RF designers for 2G and 3G switches. But the company’s latest eSi substrates has taken off like wildfire, and are now used by all the major companies that make RF chips for smart phones.  The eSI wafers enable much higher linearity and isolation, helping designers to address some of the most advanced LTE requirements at competitive costs.  You can read more about the technical details of the wafers and how they were developed here and how they solve key challenges here.

“We are very honored to receive this award from Sony recognizing the long partnership between our companies,” said Bernard Aspar, senior vice president and general manager of Soitec’s Communication & Power Business Unit. “It demonstrates Soitec’s commitment to deliver the enabling substrates that support Sony’s RF devices business.”

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