Blogs, videos and press releases from & about the SOI ecosystem
Posted date : Jun 15, 2020

SkyWater Licenses Key FDSOI Technology From MIT Lincoln Laboratory, Moves Up Availability Of Its 90 Nm Strategic Rad-Hard By Process Offering. (press release, 11 June 2020) Transferring MIT Lincoln Laboratory’s proven 90 nm FDSOI process into SkyWater’s Trusted fab will enable accelerated delivery on a previously announced up to $170 million Department of Defense (DOD)-funded program at SkyWater to enhance microelectronics capabilities for the Department and develop a new 90 nm Strategic Rad-Hard by Process manufacturing flow.

Green Hills Software Adds Support for the Heterogeneous NXP i.MX 8 Application Processors in Airborne Safety- and Security-Critical Systems (GHS press release, 19 May 2020). Per the release, “NXP i.MX 8 applications processors have several features that are useful for avionics, airborne mission computers, and cockpit displays. With four Cortex-A53 cores and two Cortex-A72 cores, the i.MX 8QuadMax enables power consumption optimization by matching the performance requirements of each application task to the performance capacities of the different cores. The low soft-error rate of i.MX 8 processors results from a robust 28 nm FDSOI manufacturing process, which has inherently high immunity to alpha particle flux and enables high MTBF. Along with many of NXP’s product families, the i.MX 8 processors have a minimum of 10-15 years of product supply longevity.”

IBM Power9: Digging Into the Architecture and Materials – 14 May 2020. EETimes article by Jeongdong Choe ofTechInsights. This article summarizes  TechInsights’ analysis of the IBM 14HP HKMG FinFET-on-SOI eDRAM cell architecture, process, and design recently used in the IBM Power9 processor, which is fabbed by GlobalFoundries. It includes a list of new GF innovations, especially in the areas of architecture, process, materials and design.

A major advance in high-performance computing – Leti Press Release, 7 May 2020. ​CEA-Leti unveiled a state-of-the-art demonstrator chip for high-performance computing applications at ISSCC 2020. The low-cost, energy-efficient processor is built on an innovative multi-core system that is both modular and expandable. The 96-core demonstrator is arranged into six FDSOI chiplets 3D integrated onto the active 65 nm silicon interposer.

Silicon Photonics: A Marriage of Optical and Digital on GF’s RF Process – GF’s Foundry Files blog, May 07, 2020. GF and Ayar Labs collaborated on ways to optimize GF’s 45 RF SOI process for the optical structures and other functions. That technology, developed for the mmWave market, was modified to include photonic function and is now being used to build prototypes. RF SOI CMOS is an “enabling thing, because it allows us to build both transistors and optical devices in the same planar layer. And the SOI process enables extremely fast transistors, faster than most of the advanced nodes built today.”

Webcast interview with Maud Vinet (in French),Quantum hardware program manager at CEA-Leti – 6 May 2020. Maud Vinet was also a key driver in the research and development of FD-SOI, and was recently awarded the French Legion of Honor award.

Dolphin Design Unveiling innovative Energy Efficient Platforms, complete turnkey solutions for competitive SoC designs – Dolphin Design announcement, 4 May 2020. The company is releasing 4 platforms in the coming weeks: SPEED Power Management, SPEED Processing MCU, SPEED ML/AI Processing and/or SPEED Audio.

Silicon Catalyst Collaborates with Arm to Accelerate Semiconductor Startups – Silicon Catalyst press release, 29 April 2020.Arm joins as Strategic Partner and as In-Kind Partner – the first company to join the incubator in both roles. The partnership provides startups with no-cost access to a broad range of Arm® IP, tools and support.

Mixel’s MIPI D-PHY IP Integrated into the Lattice CrossLink-NX FPGAWorld’s first low-power FPGA to support D-PHY v1.2 with 2.5Gbps/lane. Mixel press release, 28 April 2020. The new CrossLink-NX FPGAs are built on Samsung’s 28nm FD-SOI technology.

GlobalFoundries Dresden Certified to Manufacture Secure Products – GF Press release, 27 April 2020. The official BSI certification extends the ability to cost effectively manufacture secure, connected products to GlobalFoundries’ 22FDX (FD-SOI) technology.

GlobalFoundries Qualifies Synopsys’ IC Validator for Signoff Verification on 22FDX Platform – Synopsys press release, 16 April 2020. With IC Validator physical verification, customers striving to take advantage of the low-power and performance benefits of GF’s FD-SOI technology can now quickly verify that their designs meet signoff requirements for manufacturability compliance and maximum yield. Signoff design rule check (DRC), design for manufacturability (DFM), layout vs schematic (LVS) and metal fill runsets and tech files are available today from GF.

FDSOI and Migration – YouTube video by Thalia Design Automation, posted 14 April 2020. Founder/CTO Sowmyan Rajagopalan talks about why analog IP reuse is a big problem for semiconductor companies, who Thalia is and how they can help. 

RF SOI can Save $Billions in 5G mmWave Network Costs with Efficient PAs – cover story in Microwave Journal, 13 April 2020. Republished here in its entirety with permission. By GlobalFoundries, Mobile Experts & Mixcomm. 

Compact Model Developed at CEA-Leti for FD-SOI Technologies Designated as a Chip-Industry Standard – Leti press release, 2 April 2020. This Is of Paramount Importance for Large Chipmakers And Positions CEA-Leti Among the Few Compact-Model Developer Teams Able to Develop and Support a Standard Model

Lattice Semiconductor Joins Silicon Catalyst In-Kind Partner Ecosystem to Foster Broader Use of FPGAs – Silicon Catalyst press release, 2 April 2020.

eNVM Technology Choices for Automotive, Industrial and Multi-market Solutions – Video posted April 2020 by GlobalFoundries and SemiWiki. 

Perceive Corporation Launches to Deliver Data Center-Class Accuracy and Performance at Ultra-Low Power for Consumer Devices – Perceive press release, 31 March 2020. Introduces breakthrough Ergo™️ edge inference processor, delivering 4+ TOPS sustainedand 55 TOPS/W, capable of processing large neural networks in 20mW. The company has partnered with the leading specialty foundry, GLOBALFOUNDRIES, to manufacture the Ergo chip on their 22FDX® platform.

Photonic Solutions From Synopsys Support Advancements in Nanoscale Optics – Synopsys press release, 30 March 2020. This latest Photonic Solutions Portfolio accelerates design of AR/VR Systems, Optical Communications, and PICs. Additional details were given by Synopsys during the SOI Consortium’s Japan Symposium.

Casio Tips Its Hat to Renesas for Its Battery-Less, Solar-Powered Smartwatch. In All About Circuits, March 19, 2020. The GBD-H1000, a new member of Casio’s G-SHOCK line of smartwatches, functions on harvested energy. It also features a heart rate monitor and GPS functionality. Casio says the new watch needs no battery since it can be completely solar powered. Casio Computer Co. chose the Renesas RE01 controller as the primary controller. Renesas’ RE01 Group products are extremely low-power devices based on SOTB (what Renesas calls their flavor of FD-SOI) process technology. (Note that Casio has been using FD-SOI based chips in their G-Shock watches since 2005.)

Bluetooth IP migration and leveraging FDSOI back gate biasing feature – Thalia Design Automation blog, 16 March 2020. By Founder/CTO Sowmyan Rajagopalan. 

QuickLogic’s eFPGA Qualified on GLOBALFOUNDRIES 22FDX® Platform for IoT and Edge AI Applications – QuickLogic press release, 11 March 2020.

D&R FDSOI IP SoC Day – Virtual IP Event – hosted by Design & Reuse, 13 March 2020. View videos & get presentations by SOI Consortium members ST, Soitec, Analog Bits, Dolphin Design, Leti and Thalia, as well as other industry experts.

Analog FD-SOI : Body biasing techniques enable designers to trade speed and power – Thalia Design Automation blog, 9 March 2020. By Founder/CTO Sowmyan Rajagopalan. 

Soitec’s engineered substrates for 5G – Soitec (press release, 4 March 2020)

Working with GF: Why MixComm Chose GF’s Industry Leading 45RFSOI Solution – GlobalFoundries, YouTube video posted 18 March 2020. 

TCAD Simulations of RF-SOI Switches with Trap-Rich Substrate – Silvaco, b 2 March 2020. 

GlobalFoundries Delivers Industry’s First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications – GlobalFoundries (press release, 27 February 2020)

NXP Announces Availability of i.MX RT600 Crossover Family of Microcontrollers – NXP (press release 24 February 2020). The i.MX RT600 crossover microcontroller (MCU) family, an ideal solution for ultra-low power, secure edge applications including audio, voice and machine learning […] manufactured [on Samsung’s] 28nm FD-SOI process, optimized for both active and leakage power.

Presentation at ISSCC 2020 Shows Role FD-SOI Can Play in Embedding Qubit Arrays with Classic Electronics to Build Large-Scale Quantum Silicon Processors – Leti (press release, 18 February 2020)

CEA-Leti Presents High-Performance Processor Breakthrough With Active Interposer and 3D Stacked Chiplets at ISSCC 2020 – from Design & Re-use, 18 February 2020. The prototype’s 96 computing cores are organized in six chiplets in 28nm FDSOI.

Toshiba: Reduction of Loss by the Latest High-breakdown-voltage SOI Processes (website post, January 2020) and Toshiba Introduces Cutting-edge Generation SOI Process for RF Switches and Low-Noise Amplifier ICs for 5G Smartphones (Toshiba press release, 27 Feb. 2020)

Mentor collaborates with Arm on unique eMRAM test solution using Samsung FDSOI technology (Mentor press release, 16 Dec. 2019)

Lattice Announces New Low Power FPGA PlatformLattice Nexus Platform on Samsung Foundry 28 nm FD-SOI Delivers Solution, Architecture and Circuit-Level Innovations to Enable Low Power Edge Applications – Lattice Semi press release, 10 December 2019.

Clients Turn to the 22FDX® Platform for Next-Generation Automotive Radar – GlobalFoundries/Foundry Files Blog, Nov 07, 2019. By Mark Granger, VP Automotive Business Development.

VeriSilicon Releases Most Advanced FD-SOI Design IP Platform on GLOBALFOUNDRIES 22FDX® for Edge AI and IoT Applications (press release, 24 October 2019) The IP Platform includes over 30 low-power, low-leakage and high-density memory compiler IPs and various key mixed signal IPs enabling VeriSilicon to provide a one-stop silicon design service to customers designing for AIoT with mature IPs to shorten custom design cycles and reduce R&D costs. FD-SOI Body-Bias technology allows the user to adjust device threshold even after the silicon’s been manufactured: it can enable dynamic tuning between High-Performance and Low-Power, and enhance the design flexibility without extra cost.

Samsung-MOSIS Collaboration (MOSIS PR, Oct. 2019). USC Viterbi’s Information Sciences Institute and foundry business at Samsung Electronics announced a collaboration to design and fabricate integrated circuits through USC ISI’s The MOSIS Service using multi-project-wafer runs. The collaboration combines MOSIS’s industry-leading integrated circuit manufacturing expertise, with Samsung’s high-performance CMOS and FD-SOI fabrication technologies. It positions ISI and Samsung’s advanced technologies to lead a new era of high-performance microelectronic design and manufacturing for the U.S. and global integrated circuits community.

sureCore PowerMiser Low Power SRAM IP Now on Samsung 28nm FDS Process Technology (Press Release, Oct. 16, 2019)

Samsung Introduces Advanced Automotive Foundry Solutions Tailored to EMEA Market at Samsung Foundry Forum 2019 Munich – Samsung (press release, 10 October 2019)

NXP Launches the GHz Microcontroller Era (press release, 2 Oct. ’19). The NXP i.MX RT1170 family is built using advanced 28nm FD-SOI technology for lower active and static power requirements. It integrates a GHz Arm Cortex-M7 and power-efficient Cortex-M4, breaks the gigahertz barrier and accelerates advanced Machine Learning applications at the edge.

The Fourth Annual FD-SOI Forum: MosChip stands out as the future of silicon solutions (MosChip PR, 22 Sept. 2019). MosChip has multiple SOC designs ongoing in multiple markets (IOT and Vision Processing) where FD-SOI technology is being adopted.

Making New Memories: 22nm eMRAM is Ready to Displace eFlash – By Martin Mason, August 29, 2019, in GlobalFoundries’ Foundry Files.

Samsung Electronics’ Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform – Samsung (press release, 15 May 2019)

Samsung Electronics Starts Commercial Shipment of eMRAM Product Based on 28nm FD-SOI Process – Samsung (press release 6 March 2019)

Soitec and Simgui Announce Enhanced Partnership and Increased Production Capacity of 200mm SOI Wafers in China, Securing Future Growth – Soitec (press release, 19 February 2019). Companies redefine their manufacturing and licensing relationship to better serve the growing global market for RF-SOI and Power-SOI products

RF SOI Shines for 5G Power Amps – by David Lammers for GlobalFoundries’ Foundry Files, February 11, 2019.

FD-SOI: How Body Bias Creates Unique Differentiation – by Manuel Sellier (Soitec), in GlobalFoundries’ Foundry Files, October 17, 2018.

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