31 of Japan’s leading SOI experts explain design for ultra-low-power applications Leading experts expect the next-generation of device
Soisic solution enables any ASIC designer using industry-standard EDA tools to move transparently into SOI Until now, any compan
The carriers’ ballistic transport is a key issue for realizing future high-speed CMOS devices. At the 2004 VLSI Technology Symposium in Honolul
Smart Cut™ enables innovative substrate solutions GaN HEMT technology holds enormous promise for increasing the power of commercial RF a
www.sii-ic.com SII's new chip can leverage energy sources such as personal body-heat or natural illumination SII (Seiko Instruments
Dr. Yoshimi reviews some recent approaches to strained SOI implementation Implementing strain into the channel of MOSFETs has become m
Ultralow-power MTCMOS/SOI technology enables self-powered wireless transmission by just touching a terminal Ultralow-power LSIs with 1- to
GAAS ® Best Of Show • Alcatel-Thales, Picogiga and their academic and laboratory partners were awarded “Best of Show” at the most recent
• Following the premier of its Xbox 360 TM video game and entertainment system, Microsoft confirmed that the unit
• Sony Computer Entertainment Inc. (SCEI) has officially released the product specifications for