ST looks at a hybrid FD-SOI/bulk approach to SOCs for multimedia.
The heterogeneous nature of System-on-Chip (SOC) design for the next generati
Hitachi’s latch-up-free, SOI-based chips enable new generations of compact medical ultrasound systems.
IBM’s roadmap to ETSOI – Extremely Thin Silicon on Insulator – calls for very thin, very flat SOI substrates. Here’s why.
UCL researchers leverage SOI in a powerful, affordable sensor design.
In pharmacology, medical diagnostics or security app
Leti has compact models ready for FD-SOI SPICE simulations.
A critical link in the move to FD-SOI is the availability of robust compact models.
FD-SOI solves challenges without complicating design and manufacturing.
Designing a successful consumer-type IC requires a balanced combination
FD-SOI is making the move towards industrialization. In this issue of ASN, experts from IBM, ST, Hitachi, Leti and Soitec detail their approaches
There’s no need to wait – Hitachi’s SOTB solution also benefits today’s mainstream low-power nodes.
Hitachi’s Hybrid Silicon-On-Thin-B
Leading equipment and materials suppliers have created the European 450mm Equipment and Materials Initiative – or EEMI 450, for short. The st
Key advances in transistor research start on SOI.
SOI has always been the substrate of choice to explore new silicon device concepts and struct
© SOI Industry Consortium 2019