More than Moore market and technology trends, Thibault Buisson, Yole Developpement
Wafer-Level Heterogeneous Integration Technology and Its Application, Prof. Shuji Tanaka, Tohoku University, Sendai, Japan
Prominent Materials of HIST to enable the IoT, Prof. G.P. Li, Calit2, University of California-Irvine, USA
Biosensors and Healthcare, Dr. Qinghuang Lin, IBM T.J. Watson Research Center, USA
Vitual Fabrication for advanced Semiconductor technology, David M. Fried, Coventor
Overview of Power SOI Application, Dr. Bernard Aspar, Soitec
Power SOI Application, Dr. James Young, Skyworks
RF SOI: A Deeper Insight for a Faster Time-to-Market, Dr. Mostafa Emam, Incize
Photonics, RF- & FD-SOI for IoT Applications, Kirk Ouellette, STMicroelectronics
SOI for RF Applications and Beyond, Alfred Zhu,, Sitri
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