17 March 2015: Shanghai Workshop MEMS & More than Moore
Posted date : Jun 20, 2019


More than Moore market and technology trends, Thibault Buisson, Yole Developpement

Wafer-Level Heterogeneous Integration Technology and Its Application, Prof. Shuji Tanaka, Tohoku University, Sendai, Japan

Prominent Materials of HIST to enable the IoT, Prof. G.P. Li, Calit2, University of California-Irvine, USA

Biosensors and Healthcare, Dr. Qinghuang Lin, IBM T.J. Watson Research Center, USA

Vitual Fabrication for advanced Semiconductor technology, David M. Fried, Coventor

Overview of Power SOI Application, Dr. Bernard Aspar, Soitec

Power SOI Application, Dr. James Young, Skyworks

RF SOI: A Deeper Insight for a Faster Time-to-Market, Dr. Mostafa Emam, Incize

Photonics, RF- & FD-SOI for IoT Applications, Kirk Ouellette, STMicroelectronics

SOI for RF Applications and Beyond, Alfred Zhu,, Sitri



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