25 & 26 October 2018: Japan SOI Design Workshop

25 & 26 October 2018: Japan SOI Design Workshop
Posted date : Oct 3, 2018

The SOI Industry Consortium has organized for the 4th time its annual workshop in Japan. During the two day workshop, leading companies working with SOI technologies met in Yokohama and discussed about designing with FD & RF SOI technologies. The second day was held in Tokyo, on More than Moore, with special focus on silicon photonics, MEMS & sensors, and the SOI manufacturing ecosystem.

PRESENTATIONS

Yokohama, Thursday, 25 October 2018: Design Methods and Tools for FD- & RF-SOI Products (Agenda)

22FDX based SoC Platform for L-4 Autonomous Driving, Wayne Dai, CEO, Verisilicon

>Silvaco’s design flow and IP blocks for SOI, Thomas Blaesi, VP Global Marketing, Silvaco

>Enabling SoC Differentiation with Collaborative Eco-System, Subramani Kengeri, CTO & VP of WW Client Solutions, Globalfoundries

>FD-SOI Product Design Methodology, Christophe Tretz, Design Advisor, SOI Industry Consortium

>SOI at Synopsys: EDA Flow and IP Support, Akira Nikaido, Director & Shunichi Suzuki, Synopsys

>Addressing the Energy Efficiency Challenges of IoT end points, Frederic Renoux, EVP, Dolphin Integration

>RF-SOI for RFFE Solution: EDA Perspective; Feng Ling, CEO, Xpeedic

FDSOI Foundry Enablement – From Concept to Mass Production, Jonathan Smith, Director, Cadence

>RF-SOI Technology and Design Enablement; Mostafa Emam, CEO, Incize

>Improving IC Reliability by Automating Power Net Robustness and Net-aware Fill with Calibre PERC, Calibre YieldEnhancer and Calibre Pattern Matching; Takashi Yabe, Application Engineering Consultant, Mentor Graphics

Tokyo – Friday, 26 October 2018 More than Moore and SOI Ecosystem (Agenda)

Distributed AI and computing at edge and nodes for sensors, Giorgio Cesana, Sr. Director, STMicroelectronics

>RF- & FD-SOI: addressing substrate supply to support accelerated growth, Jean-Marc LeMeil, Director, Soitec

>FD-SOI for ultra low power edge computing, Jon Cheek, Director, NXP

A Time-of-Flight Range Image Sensor with High Near Infrared Quantum Efficiency Using SOI-Based Fully-Depleted-Substrate Detectors, Prof. Shoji Kawahito, Shizuoka University

>An Overview of SOI based MEMS, Jean-Philippe Polizzi, MEMS Business Development Manager, Leti-CEA

>Smart Cut technology applied to MEMS: illustration in the field of ultrasonic transducers; Bruno Ghyselen, Sr. Expert, Soitec

>Si Photonics Foundry, Makoto Ueda, Director, GlobalFoundries

>Si Photonics design, Yoshimi Kitagawa, Technical Leader, Cadence

Si Photonics Applications, Giorgio Cesana, Sr. Director, STMicroelectronics

>Validation Flow for SOI photonic Integrated Circuits, Tohru Mogami, PETRA

>Putting Curves in an Orthogonal World, Masahiro Shiina, Technical Marketing Engineer, Mentor Graphics