Tag Archive 3D

NXP, Qualcomm, Skyworks to Keynote IoT Theme in Upcoming IEEE SOI-3D-SubVt (S3S) Conference (San Francisco, Oct.’16) – Late News Submissions Open, Advance Program Available
Posted date : Aug 15, 2016

IEEE S3S Conference 10-13 October 2016 Hyatt Regency San Francisco Airport IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Confer

Reminder re: top SOI Conference – IEEE S3S ’16 (SOI/3D/SubVt) CFP deadline April 15th. Keynotes: NXP, Skyworks, Qualcomm
Posted date : Mar 23, 2016

Don't forget to get your paper submitted to the top conference with a major focus on the SOI ecosystem: the IEEE S3S (SOI/3D/SubVt). The Call For

IEEE S3S, Top SOI/3D/SubVt Conference, Issues Call for Papers. Theme: Energy Efficient Tech for IoT. (Best Student Paper wins $1000)
Posted date : Dec 17, 2015

The IEEE S3S (SOI/3D/SubVt) has issued its call for papers for the 2016 conference (click here for details). The theme of the conference, which w

Don’t miss EuroSOI-ULIS, 25-27 January 2016 in Vienna. Call for papers still open.
Posted date : Nov 27, 2015

The 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, aka EUROSOI-ULIS 2016 will be t

Advanced substrates for 3D and other new markets drive new fab inspection equipment – interview with Altatech GM
Posted date : Oct 6, 2015

New approaches in chipmaking and fast-evolving specialty markets are driving the need for new equipment on the fab floor. 3D chips (be they stack

Great line-up planned for IEEE S3S (SOI, 3D and low-voltage — 5-8 October, Sonoma, CA). Advance Program available. Registration still open.
Posted date : Sep 10, 2015

Now in its third year, the 2015 IEEE S3S Conference has evolved into the premier venue for sharing the latest and most important findings in

IEEE SOI-3D-Subthreshold Conference (S3S, Oct. Sonoma, CA) Welcoming Papers til mid-May
Posted date : Apr 27, 2015

The IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (IEEE S3S) will be held in Sonoma Valley, CA 5-8 October 2015. (Phot

Interview (Leti): How a new platform helps designers get the most out of FD-SOI for IoT, ULP
Posted date : Apr 9, 2015

CEA-Leti Clean Room (© Pierre Jayet) A driving force in FD-SOI, Leti recently announced a service called Silicon Impulse®, a new FD-SOI pla

2015 – Turning the Tables for FD-SOI, RF-SOI and More
Posted date : Jan 22, 2015

If current momentum is any indication, 2015 will be the year the tables turn in favor of FD-SOI designs (with a big shout-out to IoT).  The RF-S

IEEE SOI-3D-Substhreshold (S3S) Conference Issues Call for Papers
Posted date : Jan 9, 2015

The IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (IEEE S3S) has issued the 2015 Call for Papers. Now in its 3rd ye