Tag Archive bonding

MIT-Singapore Alliance Get EVG Bonder
Posted date : Dec 16, 2013

Equipment maker EVG announced that the Singapore-MIT Alliance for Research Technology (SMART) ordered an EVG®850LT fully automated productio

Peregrine Ships 2 Billionth UltraCMOS Chip, Signs with GlobalFoundries, Celebrates 25 Years of RF-SOI
Posted date : Nov 4, 2013

Peregrine Semi's new UltraCMOS 10 RF-SOI technology platform gives smartphone manufacturers unparalleled flexibility and value without compromis

IP Value Starts at the Substrate Level
Posted date : Oct 19, 2013

If you say “IP” in the chip business, everyone thinks of cores and design. But in fact, the importance of intellectual property for chips can

III-V wafer bonding has enabled a new world record for the conversion of sunlight into electricity, announced the Fraunhofer Institute for Solar Energy Systems ISE, Soitec, CEA-Leti and the Helmholtz Center Berlin.
Posted date : Oct 1, 2013

World record solar cell with 44.7% efficiency, made up of four solar subcells based on III-V compound semiconductors for use in concentrator pho

Peregrine Semi’s RF Chip On Bonded SOS Is Main Antenna Switch in Samsung Galaxy S4 LTE-A – That’s SOI!
Posted date : Sep 26, 2013

Peregrine has announced that the company's new UltraCMOS antenna switch is driving RF performance in the Samsung Galaxy S4 LTE-A smartphone. U