Tag Archive memory

PCM/MRAM Workshop by Leti and Applied Materials During 2019 IEEE Intl. Memory Workshop
Posted date : Apr 22, 2019

Two of the big, recent breakthroughs in memory technology – eMRAM and ePCM – have gotten their start in volume manufacturing on 28nm FD-SOI.

World 1st and It’s on 28nm FD-SOI: ST Sampling ePCM (eNVM) for Automotive MCUs
Posted date : Jan 31, 2019

STMicroelectronics is now sampling 28nm FD-SOI microcontrollers (MCUs) with embedded non-volatile memory (eNVM) based on ePCM to alpha customers.

EuroSOI-ULIS (April 2019, Grenoble) + Free FD-SOI RF Technology Workshop for 5G
Posted date : Nov 19, 2018

If you've never been, you should put it on your list. EuroSOI is one of those seminal conferences where you get a front-row seat to emerging tech

Samsung Adding eFlash and eMRAM Options to 28nm FD-SOI (EETimes)
Posted date : Aug 15, 2016

Samsung is adding two embedded NVM (non-volatile memory) options to its 28nm FD-SOI line-up, Kelvin Low told EETimes' Peter Clark in a recent int

On FD-SOI, Surecore’s ULP SRAM Saves 70% Power; Company Raised $1.6 Million (SemiEngineering)
Posted date : Feb 23, 2015

SureCore's ultra-low power SRAM technology on 28nm FD-SOI saves 70% in read/write power and reduces leakage by 30% compared to 40nm bulk implemen

Leti’s M3D, now dubbed “CoolCube”, featured in EETimes
Posted date : Jan 22, 2015

Leti's M3D technology is now called "CoolCube". (Courtesy: Leti, IEDM 2014) Leti’s monolithic 3D technology, which has now been dubbed “C

Two additions to Altatech equipment lines: 10x faster ultra-thin film deposition; Doppler nano-defect inspection captures true sizing and positioning
Posted date : Dec 8, 2014

The Orion Lightspeed™ inspection system by Altatech (a division of Soitec) pinpoints the true size and location of nano-scale defects inside c

Welcome to IEEE S3S – the World’s Leading Conference for SOI, 3DI and Sub Vt (SF, 6-9 Oct)
Posted date : Sep 17, 2014

(For best rates, register by September 18th.) The 2014 IEEE SOI-3DI–Subthreshold (S3S) Microelectronics Technology Unified Conference will t

ST presents silicon R&D results on hafnium memory technology for FD-SOI MCUs
Posted date : Aug 21, 2014

Peter Clark at Electronics360 wrote about a recent presentation by an STMicroelectronics research team using hafnium oxide for non-volatile embed

New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more
Posted date : Aug 8, 2014

A new book entitled Silicon-On-Insulator (SOI) Technology, Manufacture and Applications (1st Edition) features contributions by experts at Soitec