Tag Archive MIT

Great line-up planned for IEEE S3S (SOI, 3D and low-voltage — 5-8 October, Sonoma, CA). Advance Program available. Registration still open.
Posted date : Sep 10, 2015

Now in its third year, the 2015 IEEE S3S Conference has evolved into the premier venue for sharing the latest and most important findings in

SOI for MEMS, NEMS, sensors and more at IEDM ’14 (Part 3 of 3 in ASN’s IEDM coverage)
Posted date : Jan 12, 2015

Important SOI-based developments in MEMS, NEMS (like MEMS but N for nano), sensors and energy harvesting shared the spotlight with advanced CMOS

SOI-based future device structures at IEDM ’14 (Part 2 of 3 in ASN’s IEDM coverage)
Posted date : Jan 9, 2015

Beyond FD-SOI and FinFETs, important SOI-based developments in advanced device architectures including nanowires (NW), gate all around (GAA) and

SOI-3D-SubVt (S3S): three central technologies for tomorrow’s mainstream applications
Posted date : Nov 3, 2014

ST further accelerates its FD-SOI ROs* by 2ps/stage, and reduces SRAM's VMIN by an extra 70mV. IBM shows an apple-to-apple comparison of 10nm Fin

Welcome to IEEE S3S – the World’s Leading Conference for SOI, 3DI and Sub Vt (SF, 6-9 Oct)
Posted date : Sep 17, 2014

(For best rates, register by September 18th.) The 2014 IEEE SOI-3DI–Subthreshold (S3S) Microelectronics Technology Unified Conference will t

The SOI Papers at VLSI ’14 (Part 2):
Posted date : Jul 17, 2014

Last week we posted Part 1 of our round-up of SOI papers at the VLSI Symposia – which included the paper showing that 14nm FD-SOI should match

The SOI Papers at VLSI ’14 (Part 1): Breakthroughs in 14nm FD-SOI, 10nm SOI-FinFETs
Posted date : Jul 11, 2014

The VLSI Symposia – one on technology and one on circuits – are among the most influential in the semiconductor industry. Three hugely import

2014 IEEE S3S (SOI/3D/SubVt) – Oct. SF – top speakers lined up; paper submissions til 26 May
Posted date : May 22, 2014

IEEE International SOI-3D-Subthreshold Microelectronics Technology Unified Conference 6-9 October 2014 Westin San Francisco Airport, Millbra

MIT-Singapore Alliance Get EVG Bonder
Posted date : Dec 16, 2013

Equipment maker EVG announced that the Singapore-MIT Alliance for Research Technology (SMART) ordered an EVG®850LT fully automated productio

SOI – 3D Integration – Subthreshold Microelectronics: Register now for the IEEE S3S!
Posted date : Sep 13, 2013

(Photo credit: 2013 Hyatt Regency Monterey Hotel and Spa) Last May, we already let you know about the IEEE S3S conference, founded upon