Tag Archive R&D

CEA-Leti Leading: Interview with CEO Emmanuel Sabonnadière
Posted date : Mar 17, 2020

R&D powerhouse CEA-Leti plays a major role in the SOI ecosystem. We had a chance recently to catch up with CEO Emmanuel Sabonnadière, who sh

€103M OCEAN12 Project for Automotive/Aeronautic FD-SOI in Europe (Interview)
Posted date : Aug 8, 2019

ASN had a chance to talk to François Brunier of Soitec, who’s leading this important project. Advanced Substrate News (ASN): Can you

EuroSOI-ULIS (April 2019, Grenoble) + Free FD-SOI RF Technology Workshop for 5G
Posted date : Nov 19, 2018

If you've never been, you should put it on your list. EuroSOI is one of those seminal conferences where you get a front-row seat to emerging tech

Leti and Soitec launch new Substrate Innovation Center – all partners welcome!
Posted date : Jul 11, 2018

Leti and Soitec have announced a new collaboration and five-year partnership agreement to drive the R&D of advanced engineered substrates, in

Synopsys-GF-Qualcomm Panel, Leti/Fraunhofer Team Up – FD-SOI Center Stage at Leti Innovation Days
Posted date : Sep 13, 2017

Before summer's no more than a twinkle in our eyes, let's take a moment to catch up on a key event where FD-SOI took center stage: Leti Innovatio

SOI Visionary Sorin Cristoloveanu Receives IEEE 2017 Andrew Grove Award
Posted date : May 20, 2017

(Courtesy: Grenoble INP) Sorin Cristoloveanu has been named the 2017 recipient of one of the IEEE’s highest honors, the Andrew Grove Award,

EuroSOI 2017 – 3-5 April in Athens
Posted date : Mar 24, 2017

The 2017 Joint International EuroSOI Workshop and International Conference on Ultimate Integration on Silicon (ULIS) will be held April 3-5 in At

NXP, Qualcomm, Skyworks to Keynote IoT Theme in Upcoming IEEE SOI-3D-SubVt (S3S) Conference (San Francisco, Oct.’16) – Late News Submissions Open, Advance Program Available
Posted date : Aug 15, 2016

IEEE S3S Conference 10-13 October 2016 Hyatt Regency San Francisco Airport IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Confer

Shanghai & Grenoble tech dev powerhouses team up on SOI for IoT in China and global innovation ecosystem
Posted date : Apr 5, 2016

Three of the world's More-than-Moore and SOI technology development powerhouses have signed a comprehensive agreement for ongoing collaboration

Reminder re: top SOI Conference – IEEE S3S ’16 (SOI/3D/SubVt) CFP deadline April 15th. Keynotes: NXP, Skyworks, Qualcomm
Posted date : Mar 23, 2016

Don't forget to get your paper submitted to the top conference with a major focus on the SOI ecosystem: the IEEE S3S (SOI/3D/SubVt). The Call For