Tag Archive ST

FD-SOI: The Right Choice
Posted date : May 14, 2011

Although Intel will do FinFETs at 22nm, FD-SOI remains the better alternative for most all the industry for low power and mobile apps. In the wee

Smart power saves power
Posted date : Apr 8, 2011

ST's newest SOI-based smart power technology delivers big reductions in power consumption in medical equipment, hybrid-electric-vehicle chargers

MEMS on SOI – Growing Fast and Faster
Posted date : Apr 6, 2011

In the latest ASN posting by Dr. Eric Mounier of Yole Developpement, “SOI for MEMS: A Promising Material”, he notes that SOI MEMS is growing

The SOI Papers at ISSCC 2011
Posted date : Mar 11, 2011

The International Solid-State Circuits Conference – better known as ISSCC – is of course where the big guns show us their big advances at th

ISSCC 2011
Posted date : Mar 11, 2011

Website: http://isscc.org 20-24 February 2011, San Francisco, CA ISSCC – the International Solid-State Circuits Conference – is the flags

SOI Consortium’s phenomenal FD-SOI/ARM results
Posted date : Feb 10, 2011

Up to 80% additional performance improvement on an ARM Cortex M0. 40% lower power for SRAMs. These are the amazing planar FD-SOI results just ann

STMicroelectronics and Debiotech have introduced first evaluation prototypes of a disposable
Posted date : Jul 16, 2008

STMicroelectronics and Debiotech have introduced first evaluation prototypes of a disposable, SOI-MEMS based insulin-delivery Nanopump. It c

Smaller Pixels, Brighter Pictures
Posted date : Jul 16, 2008

ST’s 3-megapixel back-illuminated image sensor for digital cameras leverages SOI, direct wafer-level bonding and thinning technologies, impro

Member Contributions *
Posted date : May 14, 2008

The SOI Industry Consortium website is a great place to find relevant SOI-related materials contributed by member companies and institutions. H

The Promise of High Resistivity SOI for Wireless Communications Systems
Posted date : Oct 31, 2007

ST reports on highly integrated SRAM and RF on 300mm wafers. Yield matches bulk with improved FOM. Wireless communications systems may soon