Tag Archive TSMC

Dr. Jean-Pierre Colinge received the 2012 IEEE Andrew S. Grove award at the last ESSDERC-ESSCIRC Conference, for his “contributions to silicon-on-insulator devices and technology.”
Posted date : May 23, 2013

IEEE Division I Director, Cor Claeys (right) of imec, honoring Dr. Jean-Pierre Colinge (left) of TSMC for receivingthe 2012 Andrew S. Grove Awar

Breakthroughs at the IEDM
Posted date : May 27, 2009

The IEEE’s International Electron Devices Meeting (IEDM) is the world’s showcase for the most important applied research breakthroughs in t

Posted date : Jul 16, 2008

Consortium participation in member events and related industry conferences is a terrific way to get the word out. TSCM Technology Symposiums The

TSMC Reports Industry-Leading Performance
Posted date : May 14, 2008

The world’s biggest foundry says its 45nm SOI process technology for the newest generation of high performance CPUs is the best in terms of s

SOI By Design
Posted date : Apr 6, 2006

The widening availability of tools and services is good news for designers in the fabless/foundry arena considering the move to SO

The SOI version of TSMC’s new 65nm Nexsys Technology
Posted date : Jul 11, 2005

• The SOI version of TSMC’s new 65nm Nexsys Technology for SoC Design will be introduced in 2007