Tag Archive TSV

Leti’s M3D, now dubbed “CoolCube”, featured in EETimes
Posted date : Jan 22, 2015

Leti's M3D technology is now called "CoolCube". (Courtesy: Leti, IEDM 2014) Leti’s monolithic 3D technology, which has now been dubbed “C

Welcome to IEEE S3S – the World’s Leading Conference for SOI, 3DI and Sub Vt (SF, 6-9 Oct)
Posted date : Sep 17, 2014

(For best rates, register by September 18th.) The 2014 IEEE SOI-3DI–Subthreshold (S3S) Microelectronics Technology Unified Conference will t

U. Washington Selects Altatech (Soitec) CVD System to Develop New Process Materials
Posted date : Apr 9, 2014

The University of Washington’s Nanofabrication Facility (WNF) is the first North American institution to get an AltaCVD™ chemical vapor

SOI for MEMS: A Promising Material
Posted date : Mar 25, 2011

A new Yole report highlights growth of SOI MEM S. Although MEMS technologies are not driven by CD shrinking as ICs, that does not mean MEMS do

SOI at IEDM 2010
Posted date : Jan 24, 2011

The 2010 IEEE International Electron Devices Meeting (IEDM) was held December 6-8, 2010 in San Francisco. The IEDM continues to be the world’s