Atmel is putting SOI-based smart-power into chips for car body electronics and powertrain applications.
Atmel’s automotive division leverages the company’s innovative mixed-signal BCD-on-SOI technology, known as SMART-I.S.®. This has enabled a new range of high-end chips for automotive electronic products that are smaller, smarter, more cost-effective and more versatile than ever before. Read More
Atmel credits its SMARTIS™ BCD-on-SOI technology for the advanced capabilities of three new families of automotive ICs. The ATA6836 half-bridge driver IC features high-temperature operation and increased reliability for both passenger car and 24V truck applications. The ATA662x family of highly integrated LIN system basis chips sets new benchmarks for EMI performance. And the highly-integrated ATA6823 H-bridge driver IC can handle up to 100A, but pulls less than 45 microamps in sleep mode.
• Atmel claims the industry’s best EMC performance with its new ATA6662 stand-alone LIN bus transceiver IC for automotive electronics. It also announced the ATA6831 driver IC for smooth DC motor control with reduced noise in automotive and industrial applications. Both are based on the company’s high-voltage BCD-on-SOI technology (SMARTIS™), enabling a broad range of protection features and “a very attractive price.”
The 3-year program aims to develop a new generation of Smart Power Technologies for automotive and consumer applications. More than a dozen partners from industry, academia and research laboratories are participating.
The industrial partners joining Atmel include Bosch, Infineon, NXP, Siemens VDO Automotive, Soitec and X-FAB, most all of whom are active in SOI-related development.
• Atmel is using SOI instead of bulk BCDMOS for it SMARTIS™ technology. Result: chips in its new driver-IC family for automotive high-temperature applications are more reliable and can run at up to 200°C (150°C ambient). That means they can go very close to a hot engine to control flaps in turbochargers or exhaust gas recirculation systems. Likewise, for the ATA6826 driver IC for controlling body electronics (the industry’s first automotive load driver IC on SOI), SOI simplifies manufacturing and enables a reduction in chip size. Result: improved EMC performance and maximum reliability at less than $1/chip.
The widening availability of tools and services is good news for designers in the fabless/foundry arena considering the move to SOI.
Leading foundries have made the investments in manufacturing on SOI. Those that have taken the final steps – finalizing electrical characterization, constructing SPICE models, integrating design tools and building libraries – are winning business.
Chartered, for example, is producing SOI-based chips for AMD, the Microsoft Xbox®360, Via, and others in partnership with IBM. TSMC, meanwhile has announced an SOI version of its Nexsys 65nm process technology for next year.
For the high-performance fabless community, IBM itself was the first to open SOI doors to its foundry customers. Ghavam Shahidi, Director of Silicon Technology, IBM Research Division, says they see the full range – from customers that do the whole thing themselves, just getting the IBM-specific SOI IP, to those who essentially hand off the whole project to the IBM services group. Asked how big a challenge the move to SOI is, he says, “It’s not a big deal – it seems scarier than it is.”
As far as those low-power customers worried about the added cost of SOI wafers, he suggests that if they were to consider the broader picture and include things like cooling, they might find it a more cost-effective solution.
Design flow involves a series of iterative steps subject to rules and constraints – many of which are different when devices are built in SOI. SOI-specific IP is needed at each step, especially:
• In support of the logic synthesis tools used to transform the high-level RTL design into a gate-level netlist (which is the collection of “standard cells” and their electrical interconnections specific to the foundry that will do the manufacturing).
• And in the placement and routing tools to layout the chip. Either the design team has to develop SOIspecific expertise (a substantial investment), or license intellectual property (IP) from a third party (the foundry or an IP vendor).
By licensing the requisite IP, designing-in SOI becomes a transparent process. As the designer generates netlists and optimizes placement and routing, the SOI IP is applied via standard EDA tools from companies like Cadence, Synopsys and Magna.
TCAD from Synopsys, for example, can model the SOI technology from the process and device simulation standpoint, so performance of SOI and bulk silicon can be compared before choosing the right technology for the design, says a company representative. Also, engineers can optimize the SOI technology by using TCAD simulation before running costly experimental wafers.
Says Francois Thomas, Europe ICD & DFM Field Marketing Director for Cadence Design Systems, “SOI uses nearly standard processes and design but with better performance. The real difference appears for cell creation, analog simulation and DRC and parasitic extraction.”
Recently three new SOI IP and design services suppliers have helped bring SOI design to a wider community.
Soisic. Working with companies that pioneered SOI, Soisic developed extensive design expertise and intellectual property (IP), which is now available to any ASIC designer. For a simple licensing fee, a design team can transparently integrate the SOI-specific design considerations into the design flow – without a special understanding of SOI (things like the history effect, for example) and the differences with bulk. No additional investment in time, training or libraries is needed
Innovative Silicon (ISi). ISi has harnessed the SOI “floating body effect” for memory cells that are twice as dense as existing DRAM and five times as dense as existing SRAM. This proprietary “Z-RAM™” (for Zero capacitor DRAM) technology uses standard SOI logic processes without new materials or extra process or masking steps. For most SoC and microprocessor ICs, this results in SOI being a lower-cost solution than bulk silicon. AMD is the first licensee.
CISSOID. As a fabless player, CISSOID designs custom analog, mixed and digital ASICs, with a specialty in SOI-based high temperature components for oil & gas, aeronautics, space and automotive applications. For low-power and RF applications, CISSOID offers design services, IP development and consulting for optimization of SOI analog and RF circuits.
For designers of mixed-signal, analog and RF devices, a growing number of major foundries have been actively promoting their SOI services.
For example, Honeywell offers RF SOI foundry services, supported by a comprehensive tool set and optional design services. The company points out that the SOI-enabled integration of mixed signal and high-voltage applications with complex control functions performed at low power on a single chip ultimately reduces cost.
Others like Atmel promote their SOIbased smart power foundry services for automotive, telecommunications and consumer electronics, noting that using SOI cuts the die-area in half compared to standard bulk technology. The X-Fab foundry service offers SOI-based analog/mixed-signal and MEMS.
All things considered, SOI is now well within the grasp of the greater chip design community.