Tag Archive FDX

ByAdele Hars

GF FD-SOI: Fab for China, Expansion in Europe

SOI Consortium member GlobalFoundries is teaming up with the Chengdu municipality to build a fab in western China offering FD-SOI (see press release here). The partners plan to establish a 300mm fab to support the growth of the Chinese semiconductor market and to meet accelerating global customer demand for 22FDX®, GF’s 22nm FD-SOI process technology. The Chengdu fab is expected to begin volume production of 22FDX in 2019.

In Germany, GF plans to grow the overall FD-SOI capacity of its Fab 1 facility in Dresden by 40 percent by 2020.  GF says they need the new capacity to meet demand for IoT, smartphone processors, automotive electronics, and other battery-powered wirelessly connected applications. Dresden will continue to be the center for FDX technology development. GF engineers in Dresden are already developing the company’s next-generation 12FDXTM technology, with customer product tape-outs expected to begin in the middle of 2018.

In Singapore, GF will also add new capabilities to its industry-leading RF-SOI technology.

ByGianni PRATA

Cadence tools enabled for GF 22FDX FD-SOI. Validated on ARM Cortex-A17. Reference flow available.

Cadence has announced that its digital and signoff tools are now enabled for the current version of the GLOBALFOUNDRIES® 22FDX™ platform reference flow (see press release here). GF has qualified these tools for the 22FDX reference flow to provide customers with the design flexibility of software-controlled body bias to manage power, performance and leakage needed to create next-generation chips for mainstream mobile, IoT and consumer apps. In addition, the ARM® Cortex®-A17 processor was used to validate the implementation flow with the Cadence® Innovus™ Implementation System and Genus™ Synthesis Solution.

Cadence collaborated with GF on the development of the PDK for the 22FDX platform. The Cadence digital implementation tools support the capability of forward and reverse body bias (FBB/RBB) to optimize the performance/power tradeoffs, implant-aware and continuous diffusion-aware placement, tap insertion and body bias network connectivity according to high voltage rules. The digital implementation tools also support double-patterning aware parasitic extraction (PEX) and design for manufacturing (DFM).

“The 22FDX reference flow can enable customers to achieve real-time tradeoff between static power, dynamic power and performance to create innovative products,” said Pankaj Mayor, GF Biz Dev VP.